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ChipMOS REPORTS JUNE 2018 AND 2Q18 REVENUE

HSINCHU, Taiwan, July 10, 2018 /PRNewswire-FirstCall/ -- ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS), an industry leading provider of outsourced semiconductor assembly and test services ("OSAT"), today reported its unaudited consolidated revenue for the month of June 2018 and for the second quarter ended June 30, 2018.  All U.S. dollar figures cited in this press release are based on the exchange rate of NT$30.43 to US$1.00 as of June 29, 2018.

Revenue for the month of June 2018 was NT$1,550.2 million or US$50.9 million, an increase of 1.8% from the month of May 2018 and an increase of 9.9% from the same period in 2017. 

Revenue for the second quarter of 2018 was NT$4,491.6 million or US$147.6 million, representing an increase of 12.0% from the first quarter of 2018, and a decrease of 1.1% from the second quarter of 2017. 

The Company noted it is continuing to benefit from strong demand from smartphone related products, combined with an increase in average selling prices of DDIC earlier in the second quarter. The Company's DDIC wafer test business is operating at full capacity with increasing demand led by TDDI for smartphones.

Consolidated Monthly Revenues (Unaudited)



June 2018

May 2018

June 2017

MoM Change

YoY Change

Revenues

(NT$ million)

1,550.2

1,522.3

1,411.1

1.8%

9.9%







Revenues

(US$ million)

50.9

50.0

46.4

1.8%

9.9%


Consolidated Quarterly Revenues (Unaudited)



Second Quarter 2018

First Quarter 2018

Second Quarter 2017

QoQ Change

YoY Change

Revenues

(NT$ million)

4,491.6

4,010.9

4,541.2

12.0%

-1.1%







Revenues

(US$ million)

147.6

131.8

149.2

12.0%

-1.1%

About ChipMOS TECHNOLOGIES INC.:

ChipMOS TECHNOLOGIES INC. (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS) (http://www.chipmos.com) is an industry leading provider of outsourced semiconductor assembly and test services. With advanced facilities in Hsinchu Science Park, Hsinchu Industrial Park and Southern Taiwan Science Park in Taiwan, ChipMOS provide assembly and test services to a broad range of customers, including leading fabless semiconductor companies, integrated device manufacturers and independent semiconductor foundries.

Forward-Looking Statements

This press release may contain certain forward-looking statements. These forward-looking statements may be identified by words such as 'believes,' 'expects,' 'anticipates,' 'projects,' 'intends,' 'should,' 'seeks,' 'estimates,' 'future' or similar expressions or by discussion of, among other things, strategy, goals, plans or intentions. These statements may include financial projections and estimates and their underlying assumptions, statements regarding plans, objectives and expectations with respect to future operations, products and services, and statements regarding future performance. Actual results may differ materially in the future from those reflected in forward-looking statements contained in this document, due to various factors.  Further information regarding these risks, uncertainties and other factors are included in the Company's most recent Annual Report on Form 20-F filed with the U.S. Securities and Exchange commission (the "SEC") and in the Company's other filings with the SEC.

Contacts:

In Taiwan

Dr. G.S. Shen

ChipMOS TECHNOLOGIES INC.

+886-3-5668877

g.s._shen@chipmos.com

In the U.S.

David Pasquale

Global IR Partners

+1-914-337-8801

dpasquale@globalirpartners.com

 

Cision

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