Research and Markets has announced the addition of the "Global Die Bonder Equipment Market 2017-2021" report to their offering.
The global die bonder equipment market to grow at a CAGR of 2.28% during the period 2017-2021.
The report, Global Die Bonder Equipment Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.
According to the report, one driver in market is incentives and discounts for long-term customers. The semiconductor capital equipment industry is defined by relationship-based sales. The selling price of such equipment is usually in the range of $100,000 to $1,000,000. Therefore, manufacturers develop long-standing relations with customers for buying their products. The main aim of such relations is to convince their customers to procure the necessary equipment from them by offering incentives and discounts for future purchases.
Equipment manufacturers mostly target those customers who tend to procure equipment for a significant sum, thereby accounting for more than 5%-10% of their global sales. Semiconductor device manufacturers and packaging houses may consider repeated purchase in the future as they get attracted by the discounts and incentives. Thus, equipment vendors offer price discounts to have a sustaining customer base.
- ASM Pacific Technology (ASMPT)
- Kulicke & Soffa
- Palomar Technologies
Other prominent vendors
- DIAS Automation
- Toray Engineering
- Demand for high-quality semiconductor ICs for wireless devices and IoT applications.
- For a full, detailed list, view the full report
Key Topics Covered:
PART 01: Executive summary
PART 02: Scope of the report
PART 03: Research Methodology
PART 04: Introduction
PART 05: Market landscape
PART 06: Market segmentation by end-user
PART 07: Geographical segmentation
PART 08: Key leading countries
PART 09: Decision framework
PART 10: Drivers and challenges
PART 11: Market trends
PART 12: Vendor landscape
PART 13: Appendix
For more information about this report visit http://www.researchandmarkets.com/research/5t4c33/global_die_bonder