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Global Semiconductor Manufacturing Equipment Markets, 2020-2025

DUBLIN, Jan. 10, 2020 /PRNewswire/ -- The "Semiconductor Manufacturing Equipment Market by Front-end Equipment (Lithography, Wafer Surface Conditioning, Deposition), Back-end Equipment, Fab Facility Equipment, Product Type, Dimension, Supply Chain Participant, Region - Global Forecast to 2025" report has been added to ResearchAndMarkets.com's offering.

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The global semiconductor manufacturing equipment market is projected to grow from USD 66.1 billion in 2020 to USD 103.5 billion by 2025, at a CAGR of 9.4% from 2020 to 2025.

Key factors fueling the growth of this market include the growing consumer electronics market and an increase in the number of foundries and trend of miniaturization and technology migration.

Market for wafer surface conditioning is projected to grow at highest CAGR during forecast period among front-end equipment

Among different types of front-end equipment, wafer surface conditioning is expected to grow at the highest CAGR from 2020 to 2025 The chemical mechanical planarization process in wafer surface conditioning has a key role, to plane the wafer surface and smoothen the wafer surface that is required to manufacture more powerful semiconductor devices. It helps in the elimination of particle impurities from the surface layer without damaging the surface structure.

Market for wafer testing equipment is projected to grow at highest CAGR during 2020-2025

Among back-end equipment, the wafer testing equipment is projected to witness the highest CAGR from 2020 to 2025. Although the testing equipment is mostly focused on back-end processes, it is also used in front-end processes. These testing devices are vital for testing electronic devices for functionality and performance at different points during the semiconductor manufacturing process.

With new technological development, there is an increase in the design complexities and development of new products. The increased investments in R&D and technological advancement in networking and communication devices has raised the demand for best-of-class ICs and SOCs. This need can be satisfied by enabling the investment in testing equipment for developing the best quality ICs.

Semiconductor manufacturing equipment for memory device accounted for largest market share in 2019

Among products, the memory segment is projected to lead the semiconductor manufacturing equipment market from 2020 to 2025. New technologies in memory, such as MRAM, ZRAM, PCRAM, and RRAM, are expected to replace most of the traditional technologies. This shift in the memory market has demanded the change in dynamics of manufacturing equipment, enforcing semiconductor manufacturing equipment providers to develop more efficient designs for the device manufacturers.

APAC is expected to hold largest share of semiconductor manufacturing equipment market in 2025

APAC is expected to hold the largest share of the semiconductor manufacturing equipment market in 2025. The development of semiconductor devices in Asian economies such as China, Japan, South Korea, and Taiwan drives the semiconductor equipment market.

The region houses semiconductor fabrication facilities of a few of the major IDM firms such as Intel (US), Micron (US), NXP Semiconductors (Netherlands), SK Hynix (South Korea), Samsung (South Korea), and Texas Instruments (US). ASM Pacific Technology Ltd. (Singapore), SHIBUYA CORPORATION (Japan), Kulicke & Soffa (Singapore), and Shinkawa Ltd. (Japan) are among a few of the major players in this market that have headquarters in APAC.

Along with these international players, the Chinese market is showing impressive growth due to the emergence of local players offering low-cost semiconductor manufacturing equipment. These factors help the semiconductor manufacturing equipment market to grow in the APAC region.

Major players profiled in this report:

  • Tokyo Electron
  • LAM Research
  • ASML
  • Applied Materials
  • KLA-Tencor
  • Screen Holdings
  • Teradyne
  • Advantest Corporation
  • Hitachi High-Technologies
  • Plasma-Therm

Key Topics Covered

1 Introduction

2 Research Methodology

3 Executive Summary

4 Premium Insights
4.1 Attractive Growth Opportunities in Semiconductor Manufacturing Equipment Market
4.2 Market, By Country
4.3 Market, By Product Type
4.4 Front-End Market, By Equipment Type and Region

5 Market Overview
5.1 Introduction
5.2 Market Dynamics
5.2.1 Drivers
5.2.1.1 Increasing Investments in R&D Facilities
5.2.1.2 Increasing Demand for Electric and Hybrid Vehicles
5.2.1.3 Growing Consumer Electronics Market and Increasing Number of Foundries
5.2.1.4 Trend of Miniaturization and Technology Migration
5.2.1.5 High Demand for Chips to Provide Computation Power and Connectivity for AI Applications
5.2.2 Restraints
5.2.2.1 High Purchase and Maintenance Costs
5.2.2.2 Complexity of Patterns and Functional Defects in Manufacturing Process
5.2.3 Opportunities
5.2.3.1 Rising Demand for Silicon-Based Sensors for IoT Devices
5.2.3.2 Expanding Chip Industry in China
5.2.3.3 Growing Number of Data Centers and Servers
5.2.3.4 Developing Market for Advanced Packaging Products
5.2.4 Challenges
5.2.4.1 Technical Problems Faced During Fabrication Process
5.2.4.2 Increased Complexities Related to Miniaturized Structures of Circuits
5.3 Value Chain Analysis

6 Semiconductor Manufacturing Equipment Market, By Front-End Equipment
6.1 Introduction
6.2 Lithography
6.2.1 DUV Lithography
6.2.1.1 I-Line, KRF, ARF Dry, and ARFI are Some of the Key Sources Used in DUV Lithography
6.2.2 Euv Lithography
6.2.2.1 EUVL Designs Triple Or Even Quadruple Patterning at 10 Nm and

7 Nm Nodes and is Expected to Achieve 5 Nm Nodes
6.3 Wafer Surface Conditioning
6.3.1 Etching
6.3.1.1 Piranha Etch, Potassium Hydroxide (Koh)Etch, and Silicon Nitride Etch are Some of the Key Wet Etching Techniques
6.3.2 Chemical Mechanical Planarization
6.3.2.1 CMP Plays A Crucial Role in Removing Unwanted Conductive Or Dielectric Materials on Silicon Wafers
6.4 Wafer Cleaning
6.4.1 Single-Wafer Spray System
6.4.1.1 Single-Wafer Spray System is an Effective Cleaning Technique With Minimal Damage
6.4.2 Single-Wafer Cryogenic System
6.4.2.1 Single-Wafer Cryogenic System is an Effective Technique in Post-Chemical Mechanical Polishing (CMP) Cleaning Processes
6.4.3 Batch Immersion Cleaning System
6.4.3.1 Batch Immersion Cleaning System is the Most Cost-Effective and Time-Saving Systems
6.4.4 Batch Spray Cleaning System
6.4.4.1 Batch Spray Cleaning System Can Process Large Batches With High Throughput Or Small Batches With Short Cycle Times
6.4.5 Scrubber
6.4.5.1 Scrubbers are One of the Most Commonly Used Tools for Mechanical Cleaning of Wafers
6.5 Deposition
6.5.1 Pvd
6.5.1.1 Pvd is A Commonly Used Deposition Technique for Low Accuracy Films
6.5.2 Cvd
6.5.2.1 Cvd is the Key Technique Used for Production of Thin Films and Complex Layered Micro- and Nano-Structures
6.6 Other Front-End Equipment

7 Semiconductor Manufacturing Equipment Market, By Back-End Equipment
7.1 Introduction
7.2 Assembly and Packaging
7.2.1 Osat Companies are Contributing Significantly to the Growth of Assembly and Packaging Equipment Segment
7.3 Dicing
7.3.1 Plasma Dicing is Better Than Conventional Blade and Laser Dicing
7.4 Metrology
7.4.1 Growth in Automation has Led to Increased Penetration of Metrology Equipment to Reduce Defects
7.5 Bonding
7.5.1 3D Semiconductor Assembly and Packaging are Key Growth Factors for Bonding Equipment Segment
7.6 Wafer Testing
7.6.1 Rising Demand for High-Quality Electronic Products has Raised the Need for Testing Equipment During Fabrication and Assembly

8 Semiconductor Manufacturing Equipment Market, By Fab Facility
8.1 Introduction
8.2 Automation
8.2.1 Automation Equipment Help in Resolving Complexities in Processes, Minimizing Waste, Reducing Costs, and Planning and Utilizing Resources Optimally
8.3 Chemical Control
8.3.1 Chemical Control Equipment Provide Controlled, Repeated, and Reliable Delivery of Chemicals in Semiconductor Manufacturing Process
8.4 Gas Control
8.4.1 Gas Control Equipment Play A Key Role in Providing Precisely Controlled Mix of Gases in Wafer Manufacturing Process
8.5 Others
8.5.1 Probing Machines are Majorly Used to Perform Electric Tests of Chips

9 Semiconductor Manufacturing Equipment Market, By Product Type
9.1 Introduction
9.2 Memory
9.2.1 Shift in Memory Market Leads to Demand for Advanced Semiconductor Manufacturing Equipment
9.3 Foundry
9.3.1 Pure-Play Foundries Expected to Witness Strong Growth Due to Contracts From Fabless Players
9.4 Logic
9.4.1 Logic Devices are Critical Components in Electronic Circuits That Operate as Per Defined Programs
9.5 MPU
9.5.1 Extensive Use of MPUs in Many Consumer Electronics Expected to Boost Their Demand During Forecast Period
9.6 Discrete
9.6.1 Demand for Discrete Components is Driven By Their Role of Being A Base of Any Electronic Circuit
9.7 Analog, Mems, and Other
9.7.1 Growth of Mems is Attributed to Demand From Consumer Electronics

10 Semiconductor Manufacturing Equipment Market, By Dimension
10.1 Introduction
10.2 2D
10.2.1 2D IC Technology is Used in Several Conventional High-End Applications Such as Smartphones and Tablets
10.3 2.5D
10.3.1 Use of Silicon Interposers on 2.5D ICs is an Incremental Step to Increase Capacity and Performance of Semiconductor Devices
10.4 3D
10.4.1 Need for Improved Electrical Performance Expected to Increase Demand for 3D ICs

11 Semiconductor Manufacturing Equipment Market, By Supply Chain Participant
11.1 Introduction
11.2 IDM Firms
11.2.1 IDM Firms Rapidly Adopt Innovative Technologies and are Expected to Lead Market During Forecast Period
11.3 Osat Companies
11.3.1 Osat Companies to Play Significant Role Owing to Challenges Faced By Foundries Related to Assembly and Packaging
11.4 Foundries
11.4.1 Foundries have Dominance in APAC Region Owing to Presence of Major Players

12 Semiconductor Manufacturing Equipment Market, By Region
12.1 Introduction
12.2 Americas
12.3 EMEA
12.4 APAC

13 Competitive Landscape
13.1 Overview
13.2 Key Players in Semiconductor Manufacturing Equipment Market
13.3 Competitive Leadership Mapping
13.3.1 Visionary Leaders
13.3.2 Innovators
13.3.3 Dynamic Differentiators
13.3.4 Emerging Companies
13.4 Strength of Product Portfolio (For 25 Companies)
13.5 Business Strategy Excellence (For 25 Companies)
13.6 Competitive Scenario
13.6.1 Product Launches & Developments
13.6.2 Partnerships, Collaborations, and Agreements
13.6.3 Mergers & Acquisitions and Expansions

14 Company Profiles
14.1 Introduction
14.2 Key Players
14.2.1 Tokyo Electron (TEL)
14.2.2 LAM Research
14.2.3 ASML
14.2.4 Applied Materials
14.2.5 Kla-Tencor
14.2.6 Screen Holdings
14.2.7 Teradyne
14.2.8 Advantest
14.2.9 Hitachi High-Technologies Corporation
14.2.10 Plasma-Therm
14.3 Right-To-Win (Key Market Players)
14.4 Other Companies
14.4.1 Rudolph Technologies
14.4.2 Veeco Instruments
14.4.3 EV Group
14.4.4 Nanometrics
14.4.5 Nordson
14.4.6 Advanced Dicing Technologies
14.4.7 Quik-Pak
14.4.8 Evatec
14.4.9 Noivion
14.4.10 Semiconductor Equipment Corporation

For more information about this report visit https://www.researchandmarkets.com/r/wyhrqv

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