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Media Alert: Rambus to Present at Rosenblatt and Nasdaq Conferences

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SAN JOSE, Calif., June 02, 2022--(BUSINESS WIRE)--Rambus Inc. (Nasdaq: RMBS), a provider of industry-leading chips and silicon IP making data faster and safer, today announced that its executives will present at two upcoming investor events in June.

Steven Woo, fellow and distinguished inventor, will present at:

  • Rosenblatt 2nd Annual Technology Virtual Summit on June 9, 2022 at 1:00 p.m. PT.

Luc Seraphin, chief executive officer, will present at:

  • Nasdaq 46th Investor Conference in London, UK on June 14, 2022 at 8:00 a.m. PT.

The presentations will be available through a webcast which can be accessed on the Rambus Investor Relations website at investor.rambus.com. A replay of the presentations will also be available on the website following the events.

About Rambus Inc.

Rambus is a provider of industry-leading chips and silicon IP making data faster and safer. With over 30 years of advanced semiconductor experience, we are a pioneer in high-performance memory subsystems that solve the bottleneck between memory and processing for data-intensive systems. Whether in the cloud, at the edge or in your hand, real-time and immersive applications depend on data throughput and integrity. Rambus products and innovations deliver the increased bandwidth, capacity and security required to meet the world’s data needs and drive ever-greater end-user experiences. For more information, visit rambus.com.

View source version on businesswire.com: https://www.businesswire.com/news/home/20220602005915/en/

Contacts

Nicole Noutsios
Rambus Investor Relations
(510) 315-1003
rambus@nmnadvisors.com