SUNNYVALE, Calif.--(BUSINESS WIRE)--
|Rambus Inc. (RMBS)|
|Mobile World Congress 2017|
Booth #7J31, Hall 7
|Fira Gran Via, Barcelona, Spain|
|February 27 – March 2, 2017|
Join us in the Rambus booth, #7J31, to experience the future of frictionless shopping and transport. Highlighting its latest mobile payment solutions, Rambus will demonstrate how consumers can digitize physical payment cards into a secure mobile wallet with tokenization and Host Card Emulation (HCE). As well, Rambus will be showcasing its smart ticketing solutions, bringing greater convenience and security to travelers and transport operators worldwide.
Interested in learning more? Schedule a meeting with us at Mobile World Congress today.
About Rambus Inc.
Rambus (RMBS) creates innovative hardware and software technologies, driving advancements from the data center to the mobile edge. Our chips, customizable IP cores, architecture licenses, tools, services, software, training and innovations improve the competitive advantage of our customers. We collaborate with the industry, partnering with leading ASIC and SoC designers, foundries, IP developers, EDA companies and validation labs. Our products are integrated into tens of billions of devices and systems, powering and securing diverse applications, including Big Data, Internet of Things (IoT), mobile, consumer and media platforms. At Rambus, we are makers of better. For more information, visit rambus.com.