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TSMC adjusts capacity to satisfy rising orders for services, DigiTimes says

TSMC (TSM) sees its in-house capacity for wafer bumping services will fail to meet customer demand and plans to outsource more orders for wafers for use in the manufacture of graphic chips and power management ICs, according to DigiTimes, citing industry sources. The sources disclosed that the company plans to outsource wafer bumping production to backend partners such as Advanced Semiconductor (ASX), Amkor Technology (AMKR) and Siliconware Precision (SPIL).