U.S. Markets close in 1 hr 1 min

TSMC buliding its bumping capacity to 150,000 wafers a month, DigiTimes says

TSMC has built its bumping capacity to 150,000 12-inch wafers a month as total shipments amounted to 5M units, reports DigiTimes. According to industry sources, the growth began as the main bumping facilities of Advanced Semiconductor Engineering were ordered to cease operations.