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TSMC Files Annual Report on Form 20-F for 2021

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HSINCHU, Taiwan, April 14, 2022--(BUSINESS WIRE)--TSMC (TWSE: 2330, NYSE: TSM) today filed its 2021 annual report on Form 20-F with the U.S. Securities and Exchange Commission.

The report is available at https://investor.tsmc.com/english/sec-filings. Hard copies of the report are also available, free of charge, upon email request to g_sec@tsmc.com.

ABOUT TSMC

TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.

TSMC deployed 291 distinct process technologies, and manufactured 12,302 products for 535 customers in 2021 by providing broadest range of advanced, specialty and advanced packaging technology services. TSMC is the first foundry to provide 5-nanometer production capabilities, the most advanced semiconductor process technology available in the world. The Company is headquartered in Hsinchu, Taiwan. For more information please visit https://www.tsmc.com.

View source version on businesswire.com: https://www.businesswire.com/news/home/20220413005417/en/

Contacts

TSMC Spokesperson:
Wendell Huang
Vice President and CFO
Tel: 886-3-505-5901

Media Contacts:
Nina Kao
Head of Public Relations
Tel: 886-3-563-6688 ext.7125036
Mobile: 886-988-239-163
E-Mail: nina_kao@tsmc.com

Hui-Chung Su
Public Relations
Tel: 886-3-563-6688 ext. 7125033
Mobile: 886-988-930-039
E-Mail: hcsuq@tsmc.com