ANDOVER, MA--(Marketwire - Mar 11, 2013) - Vicor Corporation (
Vicor's CEO, Dr. Patrizio Vinciarelli, will deliver a plenary speech addressing advances in modular Power Components. This plenary session, titled 'Power Components Come of Age,' is scheduled from 3:30 PM to 4:00 PM on Monday, March 18.
Vicor will also participate in these special sessions at APEC 2013:
- Wednesday, March 20 -- Technical Session -- DC-DC Converters for Powering VLSI Devices: Technical presentation focused on a high-efficiency, high-density Factorized Power system providing VR 12.0 compliant power to a microprocessor directly from a 48 V input, presented by Eduardo Oliveira, Principal Applications Engineer, Vicor. This session begins at 8:30 AM.
- Thursday, March 21 -- Dialogue Session -- Modeling, Simulation, and Control: Presentation focused on temperature-related MOSFET power loss modeling and optimization for DC-DC converters, presented by Harry Vig, Principal Applications Engineer, Vicor. This session begins at 11:30 AM.
- Thursday, March 21 -- Industry Session -- 3D Packaging for Power Electronics: Presentation focused on 3D cooling of new high density DC-DC converters, presented by Stephen Oliver, VP of VI Chip Marketing, Vicor. This session begins at 2:00 PM.
"Vicor is proud to be a Diamond Partner of APEC 2013," said Robert DeRobertis, Director, Global Marketing, Vicor. "This is an exciting time for our industry as customer expectations challenge power electronics, and this event gives us an opportunity to showcase breakthrough innovations that enable Vicor to meet and surpass these expectations."
APEC 2013 attendees can visit Vicor in Booth # 731.
As The Premier Event in Applied Power Electronics™, APEC focuses on the practical and applied aspects of the power electronics business. The conference includes professional development courses taught by world-class experts and presentations of peer-reviewed technical papers covering a wide range to topics of interest in power electronics. www.apec-conf.org
About Vicor Corporation
Headquartered in Andover, Massachusetts, Vicor Corporation designs, manufactures and markets innovative, high-performance modular power components, from bricks to semiconductor-centric solutions, to enable customers to efficiently convert and manage power from the wall plug to the point-of-load. Complementing an extensive portfolio of patented innovations in power conversion and power distribution with significant application development expertise, Vicor offers comprehensive product lines addressing a broad range of power conversion and management requirements across all power distribution architectures, including CPA, DPA, IBA, FPA™ and CBA. Vicor focuses on solutions for performance-critical applications in the following markets: enterprise and high-performance computing, telecommunications and network infrastructure, industrial equipment and automation, vehicles and transportation and aerospace and defense electronics. www.vicorpower.com
Vicor, VI Chip and FPA are trademarks of Vicor Corporation.