061970.KQ - LB Semicon Inc.

LB Semicon Inc.

138, Cheongbuksandan-ro
Cheongbuk-eup
Pyeongtaek-Si
South Korea
82 3 1680 1600
https://www.lbsemicon.com

Sector(s): 
Industry: 
Full Time Employees: 645

Key Executives

Name	Title	Pay	Exercised	Year Born
Mr. Noh-Man Park	Chief Exec. Officer	N/A	N/A	1961
Baek Young-Ki	Exec.	N/A	N/A	N/A

Amounts are as of and compensation values are for the last fiscal year ending on that date. Pay is salary, bonuses, etc. Exercised is the value of options exercised during the fiscal year. Currency in KRW.

Description

LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as tape carrier packages, chip on glass, and chip on films; solder bumps for various flip chip packages; Cu pillar bumps; gold RDL, which is used to reposition the layout of the I/O pad; and thick Cu products. The company also provides wafer test solutions, including O/S and function checks; and back-end services, such as back grinding, laser marking, dicing saw, and visual inspection, as well as drop ship services. LB Semicon Inc. was founded in 2000 and is based in Pyeongtaek, South Korea.

Corporate Governance

LB Semicon Inc.’s ISS Governance QualityScore as of N/A is N/A. The pillar scores are Audit: N/A; Board: N/A; Shareholder Rights: N/A; Compensation: N/A.

Corporate governance scores courtesy of Institutional Shareholder Services (ISS). Scores indicate decile rank relative to index or region. A decile score of 1 indicates lower governance risk, while a 10 indicates higher governance risk.