82 3 1680 1600
Full Time Employees: 645
|Mr. Noh-Man Park||Chief Exec. Officer||N/A||N/A||1961|
LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as tape carrier packages, chip on glass, and chip on films; solder bumps for various flip chip packages; Cu pillar bumps; gold RDL, which is used to reposition the layout of the I/O pad; and thick Cu products. The company also provides wafer test solutions, including O/S and function checks; and back-end services, such as back grinding, laser marking, dicing saw, and visual inspection, as well as drop ship services. LB Semicon Inc. was founded in 2000 and is based in Pyeongtaek, South Korea.
LB Semicon Inc.’s ISS Governance QualityScore as of N/A is N/A. The pillar scores are Audit: N/A; Board: N/A; Shareholder Rights: N/A; Compensation: N/A.