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ChipMOS TECHNOLOGIES INC. (8150.TW)

Taiwan - Taiwan Delayed Price. Currency in TWD
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39.10-5.70 (-12.72%)
At close: 01:30PM CST
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  • F
    Footnotereader
    3.00 dividend per ADR share sure gave the stock good support on a terrible day for the markets.
  • c
    caffeine444444
    New Price Target today for IMOS by Credit Suisse. They went from $34 to $40. And took EPS up from $3.00 to $3.55 for 2021
  • c
    caffeine444444
    IMOS new all time high today. Traded over50 million shares last night. That after 40 million last Friday and 25 million the day before. Average daily volume is under 3 million shares. Fubon Analysts just upgraded 8150 to buy from neutral raising their price target from NT $31.50 to now NT $43. That upgrade now equates to IMOS price target to $30.5 from $22.50. The best is yet to come. I am expecting the sale of the China Factory to be announced soon and should bring in about $100 million in the 1st quarter. Also by selling the factory we won’t have to report anymore losses that in the last quarter was about $1.8 million or 5cents per share of IMOS .
  • c
    caffeine444444
    Backend firms raising test capacity for strong TDDI chips demandJulian Ho, Taipei; Willis Ke, DIGITIMES Wednesday 16 September 2020 0 Toggle DropdownTDDI chips demand for midrange 5G smartphones has been strong, particularly from Chinese handset vendors, encouraging related Taiwan-based backend houses to purchase new test equipment for additional capacities, according to industry sources.Oppo, Vivo and Xiaomi are all gearing up to #$%$ more handset market shares in China at the expense of Huawei by rolling out mid-tier 5G handsets incorporating TDDI ICs for high-definition applications to boost price-performance ratios, the sources said.Taiwan's driver IC design houses including Novatek Microelectronics have seen clear order visibility for TDDI chips through the first quarter of 2021, showing strong demand for wafer test capacity from their backend partners, whose midrange and high-end test capacities have been overly booked as a result, the sources continued.To meet the demand, backend houses are accelerating their wafer test capacity expansions. ChipMos Technologies, for instance, will move to purchase mid- and high-end test equipment in late September aiming to boost capacity by at least 10%, the sources said.The sources noted the new chips testing machines are also suitable for processing driver ICs for gaming and commercial notebooks, which have been in strong demand to support the thriving stay-at-home economy.
  • c
    caffeine444444
    News out today in Taiwan, Chipbond did a stock swap with UMC ( which is the the number 2 foundry right behind TSMC in Taiwan). This bodes well for IMOS as consolidation and JV will help the industry stay strong with great partnerships.
  • A
    Anonymous
    Another digitimes mention today. (now up to 28 articles this year - vs. 12 last year). Crossing my fingers for 2018 (probably 2H). Feels like the stock will just tread water until then. coco

    COF packaging in growing demand
    Julian Ho, Taipei; Willis Ke, DIGITIMES [Thursday 21 December 2017]
    With COF (chip on film) package technology increasingly emerging as a mainstream packaging method for driver ICs for smartphone-use LCD and OLED panels, Taiwan players in the IC packaging sector, including COF substrate maker JMC Electronics, driver IC packaging and testing specialists Chipbond Technology and ChipMOS Techonolgies, will benefit from the lucrative packaging segment, according to industry sources.

    The sources said that among the three major types of packaging, COF is gradually replacing TCP (tape carrier package) and COG (chip on glass) as a mainstay, as it is suitable for packaging driver ICs for both OLED and high-end LCD panels, regardless of panel sizes and despite involving higher costs.

    COF packaging has been mostly applied to large-size panels, while COG has been utilized to package driver ICs on midsize and small-size panels, yet not suitable for flexible display panels. And as a major packaging technology in the past, TCP is losing ground to both COF and COG due to comparatively lower pin strength on carrier tapes during the packaging process.

    The sources continued that COF tech is needed to package driver ICs on 4K LCD TV panels, small- to medium-size OLED panels and high-end TFT LCD panels produced on LTPS process, for a variety of end devices including TVs, smartphones and wearable devices.

    As a specialized maker of COF substrates, JMC Electronics is poised to enjoy significant sales momentum for its newly developed 2-metal COF substrates that can be applied to flexible panels for high-tier smartphones and wearable devices in the coming year. The company is busy installing production equipment for the new substrates and will start to supply the substrates for carrying driver ICs on OLED panels in the second half of 2018 at the earliest.

    Leading smartphone brand vendors are expected to adopt OLED for their high-end models in 2018. This will lead to a significant increase in demand for OLED panels, COF substrates and COF packaging services in the coming year and bring more business opportunities for Taiwan players in the driver IC packaging segment, industry sources said.
  • F
    Feda
    Has anyone figured out what this year's payout will be. I read through a news article and it was confusing to say the least.
  • R
    Rich
    Volume 100,000? Thats interesting.
  • a
    adixyz
    Although not a big volume, but today in the last 2 hours it spiked by 50k shares from 19.65 to 19.90. Its already ex-dividend, so its nothing to do with the dividend distribution news. Anyone has any clue what's going on....
  • D
    Dixon
    Orders for OLED driver ICs to boost Chipbond revenues in 2019-2020
    Julian Ho, Taipei; Jessie Shen, DIGITIMES Tuesday 24 July 2018 0 Toggle Dropdown
    Taiwan-based backend firm Chipbond Technology is expected to see revenues generated from orders for OLED panel driver ICs make a substantial contribution to company revenues in 2019 and 2020, according to industry sources.

    Chipbond has reportedly obtained orders for OLED driver ICs from China-based BOE Technology, which has been capable of supplying small- and medium-size OLED panels for smartphones. BOE is expected to ship OLED panels for a number of China-based smartphone vendors led by Huawei, and is striving to become a second-source supplier of Apple for providing OLED panels in 2019, the sources indicated.

    Chipbond has enjoyed robust chip-on-film (COF) packaging demand in 2018, thanks to the growing adoption of edge-to-edge displays among smartphones, the sources said. COF is generally believed to replace chip-on-glass (COG) to become the mainstream packaging method for driver ICs for use in both LCD and OLED panels.

    In addition to Chipbond, LGIT and Stemco of South Korea, Japan-based Flexceed and Taiwan-based JMC Electronics are other major suppliers of COF packaging.

    In other news, the forthcoming iPhone series will consist of three models that will all utilize COF packaged panel driver ICs, Taiwan's Central News Agency quoted market watchers as saying in a recent report. The models will be a 6.5-inch OLED iPhone, a 5.8-inch OLED one and a 6.1-inch LCD one, with the last model set to account for 50-55% of their combined shipments during the second half of 2018, according to the report
  • R
    Royco
    And 8150/IMOS parity = $20.53 @ ~ noon EST...big spread pre-CC.

    Need these guys...basically SJ ...to step up and promote positivity ...or else put this up for “strategic alternatives”...

    ....not easy with ChiComs looking down the throats of a free people but any company whose SP has underperformed for the year like this has cannot continue business as usual...

    Gltlongs
    Royco
  • R
    Royco
    Good monthly revenues, Good earnings, Good quarter, Good guidance,
    Good resilience in nose-diving market. All one can ask for in these “turbulent,Correction” times.
    8150 Parity 40cts U.S. higher after 24+million shares traded overseas.
    Gltlongs
  • c
    caffeine444444
    river IC backend firms ink 3-year supply contracts
    Julian Ho, Taipei; Jessie Shen, DIGITIMES Wednesday 22 August 2018 0 Toggle Dropdown
    Driver IC backend specialists have inked supply deals with several of their fabless clients, and have promised sufficient capacity for COF (chip-on-film) packaging over the next three years, according to industry sources.

    The contracts also cover joint investments in new equipment purchases to ensure adequate capacity available at the backend houses including Chipbond Technology and ChipMOS Technologies, the sources indicated. COF substrate supplier JMC Electronics has also reached similar deals to promise its supply for orders placed by fabless chipmakers over the next three years, the sources said.

    Both Chipbond and ChipMOS have landed a ramp-up of orders for TDDI (touch and display driver integration) chips requiring COF packaging, the sources continued. Meanwhile, JMC started scaling up its output in the second quarter for full-screen smartphones rolled out by China-based vendors.

    Chipbond, ChipMOS and JMC are all expected to enjoy brisk sales results in the second half of 2018 and first-quarter 2019, thanks to growing demand for COF packaging applied to panel driver ICs for smartphones, the sources noted.

    Demand for COF packaging is expected to boom in the second half of 2019, when more panel suppliers such as China-based ones manage to improve OLED panel production yield rates, the sources said. The production of OLED driver ICs also requires COF packaging, and the adoption of OLED displays among smartphones is set to accelerate when OLED panels become commercially available, the sources believe.

    COF is looking to replace chip-on-glass (COG) to become the mainstream packaging method for handset panel driver ICs, thanks to the growing adoption of edge-to-edge displays among smartphones.
  • R
    Royco
    Out of town, did not hear CC, if there were any questions on the U.S. call, usually very little, but

    To all who fretted about low volume, slowly declining SP, qrtly results, worried about price drop, wrong.

    Earnings, Revenues and GMs were all very reassuring, as is guidance, which usually is conservative...

    Virtually no volume, still up over 1%, but this should see another leg up, basing in low $20.+...

    Get this over $21, test and reach new highs if macro/trade nonsense eases, close the year strong imo.

    Gltlongs
    Royco
  • a
    adixyz
    For those longs on this stocks (I am in since 2007, can't believe it), this is the the price valuation we were expecting 10-12 years back compared to its peers (Chipbond). Hope there is more steam left with the Chip Sector doing so well.
  • R
    Royco
    Phony headline on Aug., 2020 revs...
    July up almost NINE (9%) PER CENT yoy, and the report shows almost same $64M revs for August as last year, and the “decline” is emphasized...
    The revs for months have been excellent, consistently over $60M!!!

    It is up to Management to correct the narrative ....or they should be held accountable for the stock to remain so significantly underpriced...

    How about a buy-out from competitors who see the bargain ... if not, maybe a U.S. chip co...hmmm
    Gltlongs
    Royco
    Gtlongs
  • a
    adixyz
    @caffeine or any IMOS analyst visiting this board - In the upcoming conference call, may I request you to strongly convey SJ that is a lifetime window of opportunity for M&A and recognize shareholder value long overdue and may be in nice way that he needs to find his replacement to do this. He is thick skin and in the past did a lip service many a times by saying "I heard you loud and clear". The yearly results and 2021 sentiments will certainly be good due to a hot Semi demand. As US ADS holders we lost the leverage after the last consolidation that took several years to happen (due to slow and single track minded SJ) and it still failed to provide shareholder value. May be the Taiwan market is not giving the right P/E due to SJ at the helm of affairs? Email to SJ are forwarded by him to their US IR Rep (David Pasquale) and we all know he is paid to provide a generic response. Time for all long time shareholders to find ways to influence/remove SJ.
  • F
    Footnotereader
    Great earnings of 2.29 per diluted share. Good growth company with 12PE makes no sense. Upcomming div of 1.57 gives yield of 5.7%. I can not find any other growth companies with such multiples. I have owned since 2008. Maybe the market is worried about China taking over Taiwan.
  • R
    Richard S
    A new 52- week low. Thanks to our crack management team.
  • R
    Royco
    Blow-out REVS, Huge Beat, March, 2021 =OVER $80MILLION U.S., excellent utilization continues...
    8150 close was BEFORE monthly/1st qrtr Release

    “....Memory assembly lines remain fully utilized, with broad end market strength and capacity constraints continuing to provide a positive backdrop.

    Revenue for the month of March 2021 was NT$2,344.6 million or US$82.3 million, representing an increase of 19.8% from February, and an increase of 19.2% from March 2020.”

    Gltlongs
    Royco
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