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ACM Research, Inc. (ACMR)

NasdaqGM - NasdaqGM Real Time Price. Currency in USD
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87.86-1.09 (-1.23%)
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Hammer

Previous Close88.95
Open87.08
Bid87.35 x 800
Ask87.90 x 1000
Day's Range85.41 - 88.05
52 Week Range31.61 - 144.81
Volume149,959
Avg. Volume324,324
Market Cap1.647B
Beta (5Y Monthly)0.79
PE Ratio (TTM)98.72
EPS (TTM)0.89
Earnings DateFeb 26, 2021
Forward Dividend & YieldN/A (N/A)
Ex-Dividend DateN/A
1y Target Est135.73
Fair Value is the appropriate price for the shares of a company, based on its earnings and growth rate also interpreted as when P/E Ratio = Growth Rate. Estimated return represents the projected annual return you might expect after purchasing shares in the company and holding them over the default time horizon of 5 years, based on the EPS growth rate that we have projected.
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  • ACM Research Broadens Furnace Semiconductor Equipment Portfolio to Support Additional Logic, Memory and Power Device Manufacturing Processes
    GlobeNewswire

    ACM Research Broadens Furnace Semiconductor Equipment Portfolio to Support Additional Logic, Memory and Power Device Manufacturing Processes

    Highly configurable dry processing system adds un-doped and doped poly LPCVD, high-temperature oxidation and annealing capabilitiesFREMONT, Calif., March 17, 2021 (GLOBE NEWSWIRE) -- Today from SEMICON China, ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, announced a significant expansion of its growing 300mm Ultra Fn furnace dry processing tool portfolio, adding the following semiconductor manufacturing processes: un-doped poly deposition, doped poly deposition, gate oxide deposition, high-temperature oxidation and high-temperature annealing. ACM will be demonstrating its technologies in booth #3659 at SEMICON China 2021, being held in Shanghai’s SNIEC on March 17-19. The new capabilities build on the configurable system’s previously announced oxide, silicon nitride (SiN) low-pressure chemical vapor deposition (LPCVD), and alloy annealing process capabilities. ACM has delivered multiple tools supporting these new applications, and expects to deliver additional units in the first half of 2021. “Our strategy has consistently been to identify markets and applications with high growth potential within the semiconductor manufacturing industry and develop leading-edge technology in collaboration with our customers to address them,” said David Wang, Chief Executive Officer and President of ACM. We are now able to perform more than 80% of batch thermal processes, including LPCVD processes for SiN, HTO, un-doped poly and doped poly deposition, gate oxide deposition process, ultra-high temperature oxidizing and annealing processes up to 1200°C. The rapid adoption of this new product line further validates our collaborative strategy.” The Ultra Fn platform was designed from the ground up to meet customers’ best-in-class requirements, as devices continue to shrink and increase in complexity. Because today’s devices are designed with complex, fine geometries, providing consistent and stable heat control is paramount in maintaining wafer integrity. To meet these demands, the Ultra Fn heater features a proprietary control algorithm, which provides stable temperature control. ACM adapted its highly configurable Ultra Fn tool with only a few changes to the components and layout to address these new applications. Designed as a configurable platform that shares common parts with ACM’s existing oxide silicon nitride system, it reduces overall costs. The platform’s configurability also enables process kits to be quickly changed to meet customers’ process requirements. ACM’s delivered its first SiN LPCVD to a key logic customer’s manufacturing facility in early 2020, where its capability for mass production was validated. ACM also delivered its furnace for alloy anneal process customized with micro-Torr level ultra-high vacuum functionality to a power device customer’s manufacturing facility at the end of 2020, where its capability has been proven for production. The new furnace processes are undergoing development and testing at customer sites, with performance expected to be demonstrated in 2021. Contact ACM to learn more about the Ultra Fn furnace portfolio and supported applications. About ACM Research, Inc.ACM develops, manufactures and sells semiconductor process equipment for single-wafer or batch wet cleaning, electroplating, stress-free polishing and thermal processes that are critical to advanced semiconductor device manufacturing as well as wafer-level packaging. The company is committed to delivering customized, high-performance, cost-effective process solutions that semiconductor manufacturers can use in numerous manufacturing steps to improve productivity and product yield. The ACM Research logo is a trademark of ACM Research, Inc. For convenience, this trademark appears in this press release without a ™ symbol, but that practice does not mean ACM will not assert, to the fullest extent under applicable law, its rights to the trademark. Media Contact:Company Contacts:Eric LawsonU.S.KiterocketRobert Metter+1-480-276-9572ACM Research, Inc.elawson@kiterocket.com+1-503-367-9753 Europe Sally-Ann Henry ACM Research, Inc. +43-660-7769721 China Xi Wang ACM Research (Shanghai), Inc. +86-21-50808868 Korea YY Kim ACM Research (Korea), Inc. +82-10-41415171 Subsidiary Contacts: Singapore Adrian Ong +65-8813-1107 Taiwan David Chang +886-921-999-884

  • These 3 Under-the-Radar Stocks Are Great Buys Right Now
    Motley Fool

    These 3 Under-the-Radar Stocks Are Great Buys Right Now

    Just when you think the stock market is about to settle down, things get crazy again. More recently, many of last year's biggest winners have plunged as investors rotated out of high-growth tech stocks and into more cyclical plays like energy and financials as Treasury yields rose, portending higher interest rates and confidence in the economic recovery. Keep reading to see three such under-the-radar stocks worth buying today: ACM Research (NASDAQ: ACMR), PubMatic (NASDAQ: PUBM), and Niu Technologies (NASDAQ: NIU).

  • ACM Research Significantly Improves Copper Plating Rate and Uniformity for Advanced Packaging Applications with New High-Speed Plating Technology
    GlobeNewswire

    ACM Research Significantly Improves Copper Plating Rate and Uniformity for Advanced Packaging Applications with New High-Speed Plating Technology

    New ECP ap capability controls the wafer-level electric field to deliver better uniformity within wafer and within die while achieving higher throughputs FREMONT, Calif., March 10, 2021 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today introduced its high-speed copper (Cu) plating technology, which is now available for its ECP ap system. The tool supports Cu pillar bumping for Cu, nickel (Ni) and tin-silver (SnAg) plating; solder bumping Ni and SnAg plating; and high-density fan-out (HDFO) WLP products’ warpage wafers, with Cu, Ni, SnAg and gold plating. The new high-speed plating technology supports the Cu plating chamber with stronger mass transfer during the plating process. According to Mordor Intelligence, the fan-out packaging market is expected to witness a compound annual growth rate (CAGR) of 18% during the forecasted period (2021 - 2026). It reports that fan-out technologies’ prevalence is mainly due to cost, reliability and customer adoption. Approximately more than 20% thinner than traditional flip-chip assembly, fan-out packaging is supplementing the slim profile trend of smartphones.1 “One of the major challenges in 3D plating applications is to plate metal film in deep vias or troughs, which have a depth of more than 200 microns, at high speed and with better uniformity,” said Dr. David Wang, ACM’s Chief Executive Officer and President. “Historically, performing copper plating for pillars at high plating rates encountered mass transport limitations that reduced the deposition rate and generated an uneven top profile of the pillar. Our new high-speed plating technology solves the mass transfer challenge while achieving a better pillar top profile and delivering improved height uniformity at a higher throughput.” ACM’s high-speed plating technology can enhance the mass transfer of Cu ions during Cu film deposition, at the same time coating all pillars on the entire wafer at the same plating rate. This allows for better uniformity within wafer and within die during high-speed plating. Wafers processed using this technology achieve wafer-level uniformity below 3%, an improvement over other approaches’ performance at the same plating rate. It also offers better coplanarity performance and higher throughput. ACM upgraded an existing customer’s ECP ap system with its new high-speed plating technology in December 2020, and has received an order for the first system equipped with the high-speed plating technology which it expects to ship to a major outsourced assembly and test (OSAT) facility in China later this month. Contact ACM to learn more about its ECP ap tool and high-speed plating technology. Mordor Intelligence, FAN OUT PACKAGING MARKET - GROWTH, TRENDS, COVID-19 IMPACT, AND FORECASTS (2021 - 2026) About ACM Research, Inc.ACM develops, manufactures and sells semiconductor process equipment for single-wafer or batch wet cleaning, electroplating, stress-free polishing and thermal processes that are critical to advanced semiconductor device manufacturing as well as wafer-level packaging. The company is committed to delivering customized, high-performance, cost-effective process solutions that semiconductor manufacturers can use in numerous manufacturing steps to improve productivity and product yield. The ACM Research logo is a trademark of ACM Research, Inc. For convenience, this trademark appears in this press release without a ™ symbol, but that practice does not mean that ACM will not assert, to the fullest extent under applicable law, its rights to the trademark. Media Contact: Company Contacts:Eric LawsonU.S.KiterocketRobert Metter+1 480-276-9572ACM Research, Inc.elawson@kiterocket.com +1 503-367-9753 Europe Sally-Ann Henry ACM Research, Inc. +43 660 7769721 China Xi Wang ACM Research (Shanghai), Inc. +86 21 50808868 Korea YY Kim ACM Research (Korea), Inc. +821041415171 Subsidiary Contacts Singapore Adrian Ong +65 8813-1107 Taiwan David Chang +866 921-999-884