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Aehr Test Systems (AEHR)

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1.7000-0.0100 (-0.58%)
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Previous Close1.7100
Open1.7800
Bid0.0000 x 1100
Ask0.0000 x 900
Day's Range1.6300 - 1.7800
52 Week Range1.1000 - 2.7800
Volume218,645
Avg. Volume165,587
Market Cap39.628M
Beta (5Y Monthly)1.00
PE Ratio (TTM)N/A
EPS (TTM)-0.0990
Earnings DateJan 07, 2021 - Jan 11, 2021
Forward Dividend & YieldN/A (N/A)
Ex-Dividend DateN/A
1y Target EstN/A
  • Aehr Test Systems to Participate at Craig-Hallum Alpha Select Virtual Conference on November 17, 2020
    GlobeNewswire

    Aehr Test Systems to Participate at Craig-Hallum Alpha Select Virtual Conference on November 17, 2020

    FREEMONT, Calif., Nov. 12, 2020 (GLOBE NEWSWIRE) -- Aehr Test Systems (NASDAQ: AEHR), a worldwide supplier of semiconductor test and reliability qualification equipment, today announced that it will participate at the Craig-Hallum 11th Annual Alpha Select Virtual Conference on Tuesday, November 17, 2020. Aehr Test President and CEO Gayn Erickson and CFO Ken Spink will be hosting virtual meetings with investors throughout the day.“We look forward to discussing our semiconductor wafer level and singulated die test and burn-in solutions and the markets they serve with investors,” said Mr. Erickson. “Aehr Test provides complete production solutions for improving yield and reliability of semiconductors, and devices such as silicon carbide semiconductors used in electric and hybrid electric vehicles, silicon photonics devices used in data centers and 5G infrastructure, and 2D/3D and other sensors used in mobile and wearable applications, which are expected to be significant revenue drivers for our products this fiscal year and next.”For additional information, or to schedule a virtual meeting with Aehr management, please contact your Craig-Hallum representative, or Aehr’s investor relations firm, MKR Investor Relations, at aehr@mkr-group.com.About Aehr Test Systems Headquartered in Fremont, California, Aehr Test Systems is a worldwide provider of test systems for burning-in and testing logic, optical and memory integrated circuits and has installed over 2,500 systems worldwide. Increased quality and reliability needs of the Automotive and Mobility integrated circuit markets are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr Test products in package, wafer level, and singulated die/module level test. Aehr Test has developed and introduced several innovative products, including the ABTSTM and FOX-PTM families of test and burn-in systems and FOX WaferPakTM Aligner, FOX-XP WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak Loader. The ABTS system is used in production and qualification testing of packaged parts for both lower power and higher power logic devices as well as all common types of memory devices. The FOX-XP and FOX-NP systems are full wafer contact and singulated die/module test and burn-in systems used for burn-in and functional test of complex devices, such as leading-edge memories, digital signal processors, microprocessors, microcontrollers, systems-on-a-chip, and integrated optical devices. The FOX-CP system is a new low-cost single-wafer compact test and reliability verification solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The WaferPak contactor contains a unique full wafer probe card capable of testing wafers up to 300mm that enables IC manufacturers to perform test and burn-in of full wafers on Aehr Test FOX systems. The DiePak Carrier is a reusable, temporary package that enables IC manufacturers to perform cost-effective final test and burn-in of both bare die and modules. For more information, please visit Aehr Test Systems’ website at www.aehr.com.Contacts:     Aehr Test SystemsMKR Investor Relations Inc. Ken SpinkTodd Kehrli or Jim Byers Chief Financial OfficerAnalyst/Investor Contact (510) 623-9400 x309 (323) 468-2300  aehr@mkr-group.com

  • Aehr to Showcase FOX-P™ Wafer-Level, Die and Module Test Solutions at Virtual SWTest Untethered 2020 Conference on November 11
    GlobeNewswire

    Aehr to Showcase FOX-P™ Wafer-Level, Die and Module Test Solutions at Virtual SWTest Untethered 2020 Conference on November 11

    FREMONT, Calif., Nov. 09, 2020 (GLOBE NEWSWIRE) -- Aehr Test Systems (NASDAQ: AEHR), a worldwide supplier of semiconductor test and reliability qualification equipment, will be showcasing its FOX-P™ platform for multi-wafer, die and module test and burn-in systems for high volume production at the Virtual SWTest (Semiconductor Wafer Test) Untethered 2020 Conference and Expo on November 11, 2020. In concert with the conference focus on wafer and die level probing, Aehr Test will be showcasing its FOX-P wafer level, singulated die and module solutions, including its WafterPak™ Contactors and DiePak® Carriers, for test and burn-in of logic, memory, optical and power devices to enhance the reliability of product quality produced by semiconductor manufacturers, with a specific focus on applications in 5G, Data Centers and Electric Vehicles. These key high-growth market segments require new technologies such as Gallium Arsenide (GaS), Gallium Nitride (GaN), Indium Phosphide (InPh) and Silicon Carbide (SiC) that require test and burn-in of every device to achieve the high-level quality standards in mission critical applications.Gayn Erickson, President and CEO of Aehr Test Systems, commented, “We look forward to discussing the unique capabilities of our FOX-P™ family of products, particularly for the silicon carbide and silicon photonic markets where we have added significant new customers who recognize the value of our solutions in achieving success in the validation of their devices.“Our wafer level test and burn-in systems are optimal for reliability qualification in the emerging silicon carbide device market that is expected to grow significantly. The high reliability requirement of SiC in automotive and industrial applications require the necessity of test and burn-in of every device, and a critical capability that only our solution can provide on the market today is the ability to test 100% of the die on a wafer in a single insertion, while providing 100% traceability of pass fail results of each device including exactly what time during the test and burn in cycle the devices failed. This is a critical feature to provide confidence to customers that they are removing all early life failures prior to shipment.“Our systems are able to test 100% of their devices on 4”, 6”, 8” and 12” wafers, and 150ºC burn-in 18 wafers at a time in a single FOX-XP system. We believe our customers are able to save significant costs by burning-in entire wafers at a time versus the high costs associated with burning-in modules. Also, there are significant cost savings as a result of detecting burn-in yield losses at wafer level compared to yield losses detected at the more expensive module level.”The SWTest untethered 2020 Conference will be a one-day virtual conference and expo featuring two keynote speakers, one in the AM and one in the PM; seven technical presentations with live Q&A; and an interactive Expo with live chat. The conference is the only industry conference that focuses on all aspects of semiconductor wafer and die level probe testing, featuring the perfect mixture of manufacturer and vendor presentations. It is not a sales show, nor an academic or theoretical conference, but rather a probe technology forum where attendees come to learn about recent developments in the industry and exchange ideas. Additional information on the conference can be found on the SWTest website at http://www.swtest.org.The solutions Aehr test will feature include: * The FOX family of products, which includes multi-wafer test solutions that are capable of functional test and burn-in/cycling of flash memories, microcontrollers and other leading edge ICs in wafer form before they are assembled into multi-die stacked packages. The FOX systems utilize Aehr Test’s FOX WaferPak Contactors or DiePak® Carriers, which provide a cost effective solution for making electrical contact with a full wafer, panel, singulated die or module in a parallel test and burn-in environment. * The FOX-XP system, available with multiple WaferPakTM Contactors (full wafer test) or multiple DiePak Carriers (singulated die/module test) configurations, is capable of functional test and burn-in/cycling of integrated devices such as 2D and 3D sensors, flash memories, Gallium Nitride (GaN), magnetic sensors, microcontrollers, optical modules, Silicon Carbide (SiC) and other leading-edge ICs in either wafer formfactor, before they are assembled into single or multi-die stacked packages, or in singulated die or module formfactor. About Aehr Test Systems Headquartered in Fremont, California, Aehr Test Systems is a worldwide provider of test systems for burning-in and testing logic, optical and memory integrated circuits and has installed over 2,500 systems worldwide. Increased quality and reliability needs of the Automotive and Mobility integrated circuit markets are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr Test products in package, wafer level, and singulated die/module level test. Aehr Test has developed and introduced several innovative products, including the ABTSTM and FOX-PTM families of test and burn-in systems and FOX WaferPakTM Aligner, FOX-XP WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak Loader. The ABTS system is used in production and qualification testing of packaged parts for both lower power and higher power logic devices as well as all common types of memory devices. The FOX-XP and FOX-NP systems are full wafer contact and singulated die/module test and burn-in systems used for burn-in and functional test of complex devices, such as leading-edge memories, digital signal processors, microprocessors, microcontrollers, systems-on-a-chip, and integrated optical devices. The FOX-CP system is a new low-cost single-wafer compact test and reliability verification solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The WaferPak contactor contains a unique full wafer probe card capable of testing wafers up to 300mm that enables IC manufacturers to perform test and burn-in of full wafers on Aehr Test FOX systems. The DiePak Carrier is a reusable, temporary package that enables IC manufacturers to perform cost-effective final test and burn-in of both bare die and modules. For more information, please visit Aehr Test Systems’ website at www.aehr.com.Contacts:     Aehr Test SystemsMKR Investor Relations Inc. Vernon RogersTodd Kehrli or Jim Byers E.V.P. of Sales & MarketingAnalyst/Investor Contact (510) 623-9400 x215(323) 468-2300 vrogers@aehr.com     aehr@mkr-group.com

  • Aehr Receives Initial Order for FOX-XP DiePak® Carriers for Mobile Device Sensors with new Optical Output Monitoring and Power Regulation per DUT
    GlobeNewswire

    Aehr Receives Initial Order for FOX-XP DiePak® Carriers for Mobile Device Sensors with new Optical Output Monitoring and Power Regulation per DUT

    FREMONT, Calif., Nov. 05, 2020 (GLOBE NEWSWIRE) -- Aehr Test Systems (NASDAQ: AEHR), a worldwide supplier of semiconductor test and reliability qualification equipment, today announced a design win and an initial order for multiple DiePak® Carriers for test and burn-in of its lead customer’s next generation 3D sensor modules for mobile devices. The customer will use these Aehr proprietary DiePaks for production qualification, test, and burn-in of these devices prior to volume production orders for additional DiePaks forecasted for later in Aehr’s current fiscal year. Gayn Erickson, President and CEO of Aehr Test Systems, commented, “We are excited to receive this order for a new design that expands deployment of our test solutions to additional devices with this large multinational customer and to engage with them earlier in the design cycle of their next generation 3D sensor modules. We continue to work closely with them and have resources on site for both engineering and production deployment of our tools during COVID-19. Aehr is seeing an uptick in interest of our FOX systems and DiePaks for production test and burn-in of complex 2D and 3D sensors in multiple mobile applications and we continue to be optimistic about this market space.“Our FOX-XP solution has many advanced technical capabilities needed for testing and burning-in these devices to meet the critical quality, reliability, and traceability requirements of this customer for their latest sensor modules. This high-power configuration of our FOX-XP system is available with up to nine individual Blades that can each test up to 1,024 devices per DiePak Carrier. In addition, the system is capable of heating or cooling devices using a proprietary design using thermal conductivity, which is much more accurate than thermal convection. It can manage up to 2 kW of thermal power and over 1000 amps per DiePak to ensure that each device’s desired junction temperature is maintained very accurately.”Aehr’s FOX systems and full wafer and singulated die and module solutions are significantly differentiated from other solutions on the market and focused on providing 100% confidence and traceability of test and burn-in of every device during the entire test and burn-in duration. The features that are critical for advanced 2D and 3D sensor module test and burn-in include: * Reading and writing individual digital identification IDs through I2C and SPI protocols across 1000s of devices * Reading and logging both digital and analog temperatures per device throughout the test and burn-in process * Automatic monitoring of current and voltage supplied against programmable limits (both high and low) and the ability to disable them in real time per DUT * Controlling temperature of the device via a new feature that allows modulating the power delivered to the device via voltage, current, and pulse width modulation of voltages and currents on a per DUT basis * Monitoring output power of VCSEL arrays, individual VCSELs, lasers, and LEDs via internal photo diodes as well as using per device external photo detection sensors in the DiePaks * Controlling the device test and burn-in temperatures via conduction (direct contact with each device) up to 150ºCThe FOX-XP system, available with multiple WaferPak™ Contactors (full wafer test) or multiple DiePak Carriers (singulated die/module test) configurations, is capable of functional test and burn-in/cycling of integrated devices such as 2D and 3D sensors, flash memories, Gallium Nitride (GaN), magnetic sensors, microcontrollers, optical modules, Silicon Carbide (SiC) and other leading-edge ICs in either wafer formfactor, before they are assembled into single or multi-die stacked packages, or in singulated die or module formfactor.About Aehr Test Systems Headquartered in Fremont, California, Aehr Test Systems is a worldwide provider of test systems for burning-in and testing logic, optical and memory integrated circuits and has installed over 2,500 systems worldwide. Increased quality and reliability needs of the Automotive and Mobility integrated circuit markets are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr Test products in package, wafer level, and singulated die/module level test. Aehr Test has developed and introduced several innovative products, including the ABTS™ and FOX-P™ families of test and burn-in systems and FOX WaferPak™ Aligner, FOX-XP WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak Loader. The ABTS system is used in production and qualification testing of packaged parts for both lower power and higher power logic devices as well as all common types of memory devices. The FOX-XP and FOX-NP systems are full wafer contact and singulated die/module test and burn-in systems used for burn-in and functional test of complex devices, such as leading-edge memories, digital signal processors, microprocessors, microcontrollers, systems-on-a-chip, and integrated optical devices. The FOX-CP system is a new low-cost single-wafer compact test and reliability verification solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The WaferPak contactor contains a unique full wafer probe card capable of testing wafers up to 300mm that enables IC manufacturers to perform test and burn-in of full wafers on Aehr Test FOX systems. The DiePak Carrier is a reusable, temporary package that enables IC manufacturers to perform cost-effective final test and burn-in of both bare die and modules. For more information, please visit Aehr Test Systems’ website at www.aehr.com.Safe Harbor Statement This press release contains certain forward-looking statements within the meaning of Section 27A of the Securities Act of 1933 and Section 21E of the Securities Exchange Act of 1934. Forward-looking statements generally relate to future events or Aehr’s future financial or operating performance. In some cases, you can identify forward-looking statements because they contain words such as “may,” “will,” “should,” “expects,” “plans,” “anticipates,” “going to,” “could,” “intends,” “target,” “projects,” “contemplates,” “believes,” “estimates,” “predicts,” “potential,” or “continue,” or the negative of these words or other similar terms or expressions that concern Aehr’s expectations, strategy, priorities, plans, or intentions. These statements are based on information available to Aehr as of the date hereof, are based on current expectations, forecasts and assumptions, and actual results could differ materially from those stated or implied due to risks and uncertainties. Forward-looking statements in this press release include, but are not limited to, statements regarding Aehr’s expectations, beliefs, intentions or strategies regarding its products and its business, including statements regarding future market opportunities and conditions; Aehr’s product capabilities; expected product shipment dates; customer orders, commitments or product uses; and Aehr’s collaboration with its customers. These forward-looking statements include risks and uncertainties such as, without limitation, customer demand and acceptance of Aehr’s products, the ability of new products to meet customer needs or perform as described, as well as general market conditions and Aehr’s ability to execute on its business strategy. The forward-looking statements contained in this press release are also subject to other risks and uncertainties, including those more fully described in Aehr’s recent 10-K, 10-Q and other reports from time to time filed with the Securities and Exchange Commission. Aehr disclaims any obligation to update information contained in any forward-looking statement to reflect events or circumstances occurring after the date of this press release.Contacts:Aehr Test SystemsMKR Investor Relations Inc. Vernon RogersTodd Kehrli or Jim Byers EVP Sales and Marketing Analyst/Investor Contact (510) 623-9400 x215(323) 468-2300 vrogers@aehr.comaehr@mkr-group.com