Previous Close | 28.42 |
Open | 28.27 |
Bid | 0.00 x 1000 |
Ask | 0.00 x 800 |
Day's Range | 27.97 - 28.39 |
52 Week Range | 17.58 - 31.38 |
Volume | |
Avg. Volume | 1,250,880 |
Market Cap | 6.987B |
Beta (5Y Monthly) | 1.94 |
PE Ratio (TTM) | 17.38 |
EPS (TTM) | 1.62 |
Earnings Date | Feb 12, 2024 - Feb 16, 2024 |
Forward Dividend & Yield | 0.32 (1.11%) |
Ex-Dividend Date | Dec 04, 2023 |
1y Target Est | 30.75 |
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In today's video, I discuss recent updates impacting Taiwan Semiconductor Manufacturing (NYSE: TSM), Amkor Technology (NASDAQ: AMKR), and Samsung. Check out the short video to learn more, consider subscribing, and click the special offer link below.
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Amkor Technology said Thursday it will spend $2 billion to build a new advanced semiconductor packaging and test facility in Arizona that will package and test chips for Apple produced at a nearby Taiwanese chipmaker TSMC facility. Amkor said it will provide advanced packaging and testing of semiconductors to support high-performance computing, automotive, and communications and when the new facility opens, Apple will be its first and largest customer. Apple separately confirmed its expanded partnership with Amkor.