|Bid||0.00 x 1000|
|Ask||0.00 x 800|
|Day's Range||27.97 - 28.39|
|52 Week Range||17.58 - 31.38|
|Beta (5Y Monthly)||1.94|
|PE Ratio (TTM)||17.38|
|Earnings Date||Feb 12, 2024 - Feb 16, 2024|
|Forward Dividend & Yield||0.32 (1.11%)|
|Ex-Dividend Date||Dec 04, 2023|
|1y Target Est||30.75|
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In today's video, I discuss recent updates impacting Taiwan Semiconductor Manufacturing (NYSE: TSM), Amkor Technology (NASDAQ: AMKR), and Samsung. Check out the short video to learn more, consider subscribing, and click the special offer link below.
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Amkor Technology said Thursday it will spend $2 billion to build a new advanced semiconductor packaging and test facility in Arizona that will package and test chips for Apple produced at a nearby Taiwanese chipmaker TSMC facility. Amkor said it will provide advanced packaging and testing of semiconductors to support high-performance computing, automotive, and communications and when the new facility opens, Apple will be its first and largest customer. Apple separately confirmed its expanded partnership with Amkor.