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Amkor Technology, Inc. (AMKR)


NasdaqGS - NasdaqGS Delayed Price. Currency in USD
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10.63-0.02 (-0.19%)
At close: 4:00PM EDT

10.70 0.07 (0.66%)
After hours: 7:34PM EDT

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Amkor Technology, Inc.

2045 East Innovation Circle
Tempe, AZ 85284
United States
480-821-5000
http://www.amkor.com

SectorTechnology
IndustrySemiconductor - Integrated Circuits
Full Time Employees27,900

Key Executives

NameTitlePayExercisedAge
Mr. James J. KimExec. ChairmanN/AN/A81
Mr. Stephen D. KelleyChief Exec. Officer, Pres and Director1.67M3.54M55
Mr. John T. KimExec. Vice Chairman862.33kN/A47
Ms. Megan FaustChief Financial Officer and Corp. VP482.43kN/A43
Mr. Gil C. TilyChief Admin. Officer, Exec. VP, Gen. Counsel and Corp. Sec.1.26MN/A63
Amounts are as of December 31, 2016 and compensation values are for the last fiscal year ending on that date. Pay is salary, bonuses, etc. Exercised is the value of options exercised during the fiscal year. Currency in USD.

Description

Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States and internationally. The company offers turnkey packaging and test services, including semiconductor wafer bumps, wafer probes, wafer back-grinds, package design, packaging, and test and drop shipment services. Its packages employ wirebond, flip chip, and copper clip and other interconnect technologies. The company also provides semiconductor testing services, such as wafer testing or probe, and final test services; flip chip chip scale package products for use in smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory, and as applications processors in mobile devices; flip chip ball grid array (BGA) products for various networking, storage, computing, and consumer applications; and flip chip molded BGA packages. In addition, it offers leadframe packages that are used in electronic devices for low to medium pin count applications; substrate-based wirebond packages, which are used to connect a die to a substrate; micro-electro-mechanical systems (MEMS) packages that are miniaturized mechanical and electro-mechanical devices; and system-in-package modules, which are used in radio frequency and front end modules, baseband processing, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid state drives. The company primarily serves integrated device manufacturers, fabless semiconductor companies, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona.

Corporate Governance

Amkor Technology, Inc.’s ISS Governance QualityScore as of June 2, 2017 is 3. The pillar scores are Audit: 1; Board: 6; Shareholder Rights: 3; Compensation: 5.

Corporate governance scores courtesy of Institutional Shareholder Services (ISS). Scores indicate decile rank relative to index or region. A decile score of 1 indicates lower governance risk, while a 10 indicates higher governance risk.