|Mr. C. S. Chang||Chairman, Chief Exec. Officer and Chairman of ASE Test Taiwan||N/A||N/A||72|
|Mr. Hung-Pen Chang||Vice Chairman and Pres||N/A||N/A||70|
|Mr. Hong Shi Tung||Chief Financial Officer and Director||N/A||N/A||59|
|Dr. Tien Yu Wu||Chief Operating Officer, Director and Chief Exec. Officer of ISE Labs||N/A||N/A||59|
|Mr. Kwai Mun Lee||Pres of Southeast Asia Operations||N/A||N/A||55|
Advanced Semiconductor Engineering, Inc. provides a range of semiconductors packaging and testing, and electronic manufacturing services in the United States, Taiwan, Asia, Europe, and internationally. It operates through Packaging, Testing, and Electronic Manufacturing Services segments. The company offers packaging services, including various packages, such as flip-chip ball grid array (BGA), flip-chip chip scale package, advanced chip scale packages, quad flat packages, thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, advanced QFN packages, plastic BGAs, and 3D chip packages; stacked die solutions in various package types; and copper wire and silver bonding solutions. It also provides advanced packages, including wafer level chip scale, flip-chip (FC) chip scale, FC package in, FC BGA/HF FCBGA, FC and wire bonding, and integrated passive device packages, as well as high-bandwidth, package on, fan-out wafer-level, and ultra-thin profile packages; IC wire bonding packages, including lead frame-based package types, such as lead frame-based packages and substrate-based packages; system-in-package (SiP) products, as well as module assembly services; and interconnect materials, as well as assembles automotive electronic products. In addition, the company offers a range of semiconductor testing services, including front-end engineering testing, wafer probing, logic/mixed-signal/RF module and SiP/ MEMS/discrete final testing, and test-related services, as well as drop shipment services. Further, it provides electronic manufacturing services in relation to computers, peripherals, communications, industrial, automotive, and storage and server applications. The company offers its packaging and testing for its customers in communication, computing, and consumer electronic/industrial/automotive sectors. Advanced Semiconductor Engineering, Inc. was founded in 1984 and is based in Kaohsiung, Taiwan.
Advanced Semiconductor Engineering, Inc.’s ISS Governance QualityScore as of N/A is N/A. The pillar scores are Audit: N/A; Board: N/A; Shareholder Rights: N/A; Compensation: N/A.