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Advanced Semiconductor Engineering, Inc. (ASX)

NYSE - NYSE Delayed Price. Currency in USD
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6.02-0.03 (-0.50%)
At close: 4:02PM EDT
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Advanced Semiconductor Engineering, Inc.

26, Chin Third Road
Nantze Export Processing Zone
Kaohsiung 811
Taiwan
886 7 361 7131
http://www.aseglobal.com

SectorTechnology
IndustrySemiconductor Equipment & Materials
Full Time Employees

Key Executives

NameTitlePayExercisedAge
Mr. C. S. ChangChairman, Chief Exec. Officer and Chairman of ASE Test TaiwanN/AN/A72
Mr. Hung-Pen ChangVice Chairman and PresN/AN/A70
Mr. Hong Shi TungChief Financial Officer and DirectorN/AN/A59
Dr. Tien Yu WuChief Operating Officer, Director and Chief Exec. Officer of ISE LabsN/AN/A59
Mr. Kwai Mun LeePres of Southeast Asia OperationsN/AN/A55
Amounts are as of December 31, 2016 and compensation values are for the last fiscal year ending on that date. Pay is salary, bonuses, etc. Exercised is the value of options exercised during the fiscal year. Currency in USD.

Description

Advanced Semiconductor Engineering, Inc. provides a range of semiconductors packaging and testing, and electronic manufacturing services in the United States, Taiwan, Asia, Europe, and internationally. It operates through Packaging, Testing, and Electronic Manufacturing Services segments. The company offers packaging services, including various packages, such as flip-chip ball grid array (BGA), flip-chip chip scale package, advanced chip scale packages, quad flat packages, thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, advanced QFN packages, plastic BGAs, and 3D chip packages; stacked die solutions in various package types; and copper wire and silver bonding solutions. It also provides advanced packages, including wafer level chip scale, flip-chip (FC) chip scale, FC package in, FC BGA/HF FCBGA, FC and wire bonding, and integrated passive device packages, as well as high-bandwidth, package on, fan-out wafer-level, and ultra-thin profile packages; IC wire bonding packages, including lead frame-based package types, such as lead frame-based packages and substrate-based packages; system-in-package (SiP) products, as well as module assembly services; and interconnect materials, as well as assembles automotive electronic products. In addition, the company offers a range of semiconductor testing services, including front-end engineering testing, wafer probing, logic/mixed-signal/RF module and SiP/ MEMS/discrete final testing, and test-related services, as well as drop shipment services. Further, it provides electronic manufacturing services in relation to computers, peripherals, communications, industrial, automotive, and storage and server applications. The company offers its packaging and testing for its customers in communication, computing, and consumer electronic/industrial/automotive sectors. Advanced Semiconductor Engineering, Inc. was founded in 1984 and is based in Kaohsiung, Taiwan.

Corporate Governance

Advanced Semiconductor Engineering, Inc.’s ISS Governance QualityScore as of N/A is N/A. The pillar scores are Audit: N/A; Board: N/A; Shareholder Rights: N/A; Compensation: N/A.

Corporate governance scores courtesy of Institutional Shareholder Services (ISS). Scores indicate decile rank relative to index or region. A decile score of 1 indicates lower governance risk, while a 10 indicates higher governance risk.