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ASE Technology Holding Co., Ltd. (ASX)

NYSE - NYSE Delayed Price. Currency in USD
10.85-0.36 (-3.21%)
At close: 04:00PM EDT
10.84 -0.01 (-0.09%)
After hours: 07:53PM EDT
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Previous Close11.21
Bid10.70 x 1800
Ask10.91 x 3200
Day's Range10.84 - 11.14
52 Week Range6.70 - 11.68
Avg. Volume6,212,090
Market Cap23.431B
Beta (5Y Monthly)1.09
PE Ratio (TTM)21.70
EPS (TTM)0.50
Earnings DateN/A
Forward Dividend & Yield0.57 (5.27%)
Ex-Dividend DateJun 30, 2023
1y Target Est10.61
Fair Value is the appropriate price for the shares of a company, based on its earnings and growth rate also interpreted as when P/E Ratio = Growth Rate. Estimated return represents the projected annual return you might expect after purchasing shares in the company and holding them over the default time horizon of 5 years, based on the EPS growth rate that we have projected.
Fair Value
-22% Est. Return

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  • PR Newswire

    ASE Technology Holding Co., Ltd. Announces Monthly Net Revenues*

    ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711, "ASEH" or the "Company"), announces its unaudited consolidated net revenues for March and 1st quarter of 2024.

  • PR Newswire

    ASE TECHNOLOGY HOLDING CO., LTD. Files 2023 Annual Report On Form 20-F

    ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711, "ASEH" or the "Company"), announces that it has filed its annual report on Form 20-F for the year ended December 31, 2023 with the U.S. Securities and Exchange Commission. The 2023 20-F is available on ASEH's website at and on the website of the U.S. Securities and Exchange Commission at Hard copies of the audited financial statements included in the 2023 Form 20-F are available to shareholders upon request

  • Business Wire

    ASE’s VIPack™ Enables Innovational AI Devices Through Advanced Interconnect Technology for Chiplets

    SUNNYVALE, Calif., March 20, 2024--Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX) (TAIEX: 3711), today announced that it has extended its advanced interconnect technology under the VIPack™ platform to meet the accelerating demand for complex chiplet integration for artificial intelligence (AI) applications. This interconnect extension advances roadmap capabilities from a chip-on-wafer interconnect pitch of 40um to 20um through advanced mi