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ASE Technology Holding Co., Ltd. (ASX)

NYSE - NYSE Delayed Price. Currency in USD
10.85-0.36 (-3.21%)
At close: 04:00PM EDT
10.84 -0.01 (-0.09%)
After hours: 07:53PM EDT
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Momentum

Momentum

Previous Close11.21
Open11.11
Bid10.70 x 1800
Ask10.91 x 3200
Day's Range10.84 - 11.14
52 Week Range6.70 - 11.68
Volume7,437,298
Avg. Volume6,212,090
Market Cap23.431B
Beta (5Y Monthly)1.09
PE Ratio (TTM)21.70
EPS (TTM)0.50
Earnings DateN/A
Forward Dividend & Yield0.57 (5.27%)
Ex-Dividend DateJun 30, 2023
1y Target Est10.61
Fair Value is the appropriate price for the shares of a company, based on its earnings and growth rate also interpreted as when P/E Ratio = Growth Rate. Estimated return represents the projected annual return you might expect after purchasing shares in the company and holding them over the default time horizon of 5 years, based on the EPS growth rate that we have projected.
Fair Value
XX.XX
Overvalued
-22% Est. Return

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  • PR Newswire

    ASE Technology Holding Co., Ltd. Announces Monthly Net Revenues*

    ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711, "ASEH" or the "Company"), announces its unaudited consolidated net revenues for March and 1st quarter of 2024.

  • PR Newswire

    ASE TECHNOLOGY HOLDING CO., LTD. Files 2023 Annual Report On Form 20-F

    ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711, "ASEH" or the "Company"), announces that it has filed its annual report on Form 20-F for the year ended December 31, 2023 with the U.S. Securities and Exchange Commission. The 2023 20-F is available on ASEH's website at www.aseglobal.com and on the website of the U.S. Securities and Exchange Commission at www.sec.gov. Hard copies of the audited financial statements included in the 2023 Form 20-F are available to shareholders upon request

  • Business Wire

    ASE’s VIPack™ Enables Innovational AI Devices Through Advanced Interconnect Technology for Chiplets

    SUNNYVALE, Calif., March 20, 2024--Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX) (TAIEX: 3711), today announced that it has extended its advanced interconnect technology under the VIPack™ platform to meet the accelerating demand for complex chiplet integration for artificial intelligence (AI) applications. This interconnect extension advances roadmap capabilities from a chip-on-wafer interconnect pitch of 40um to 20um through advanced mi