|Mr. David H. Li||Pres, CEO & Director||2.89M||1.54M||1973|
|Mr. Scott D. Beamer||VP & CFO||795.87k||N/A||1971|
|Ms. H. Carol Bernstein||VP, Sec. & Gen. Counsel||851.34k||1.98M||1960|
|Dr. Daniel D. Woodland||VP & Pres of Electronic Materials||902.9k||318.47k||1970|
|Mr. Thomas S. Roman||Principal Accounting Officer & Corp. Controller||N/A||N/A||1961|
Cabot Microelectronics Corporation, together with its subsidiaries, develops, manufactures, and sells polishing slurries and pads used in the manufacture of advanced integrated circuit (IC) devices in the semiconductor industry in chemical mechanical planarization (CMP) process. It provides CMP slurries, which are liquid solutions composed of high-purity deionized water, proprietary chemical additives, and engineered abrasives that chemically and mechanically interact with the surface material of the IC device at an atomic level; and CMP pads that are engineered polymeric materials designed to distribute and transport the slurry to the surface of the wafer and distribute it evenly across the wafer. The company's CMP slurries are used for polishing various materials that conduct electrical signals, including tungsten, copper, tantalum, and aluminum; and various materials that are used in the production of rigid disks and magnetic heads for hard disk drives, as well as used in the dielectric insulating materials that separate conductive layers within logic and memory IC devices. It also designs and produces precision polishing and metrology systems to attain near-perfect shape and surface finish on various optical components, such as mirrors, lenses, and prisms. It serves the producers of logic IC devices or memory IC devices, and providers of IC foundry services directly, as well as through distributors. Cabot Microelectronics Corporation was founded in 1999 and is headquartered in Aurora, Illinois.
Cabot Microelectronics Corporation’s ISS Governance QualityScore as of June 25, 2019 is 5. The pillar scores are Audit: 2; Board: 5; Shareholder Rights: 7; Compensation: 5.