KLA Corporation (KLAC)
Key Executives
| Name | Title | Pay | Exercised | Year Born |
|---|---|---|---|---|
| Mr. Richard P. Wallace | President, CEO & Executive Director | 3.15M | -- | 1960 |
| Mr. Bren D. Higgins | Executive VP & CFO | 1.55M | -- | 1970 |
| Mr. Ahmad A. Khan | President of Semiconductor Process Control | 1.6M | -- | 1974 |
| Mr. Brian W. Lorig | Executive Vice President of Global Support & Services | 1.01M | -- | 1974 |
| Mr. Oreste Donzella | Executive Vice President of Electronics, Packaging & Components | 1.88M | -- | 1966 |
| Mr. Virendra A. Kirloskar | Senior VP & Chief Accounting Officer | 455.18k | 3.04k | 1963 |
| Dr. Ben Bin-Ming Tsai | CTO & Executive VP of Corporate Alliances | 998.02k | -- | 1959 |
| Mr. Kevin M. Kessel C.F.A. | Vice President of Investor Relations | -- | -- | -- |
| Ms. Mary Beth Wilkinson | Executive VP, Chief Legal Officer & Corporate Secretary | 1.38M | -- | 1973 |
| Ms. Randi Polanich | Senior VP & Chief Communications Officer | -- | -- | -- |
KLA Corporation
- Sector:
- Technology
- Industry: Semiconductor Equipment & Materials
- Full Time Employees:
- 15,000
Description
KLA Corporation designs, manufactures, and markets process control, process-enabling, and yield management solutions for the semiconductor and related electronics industries worldwide. It operates through three segments: Semiconductor Process Control; Specialty Semiconductor Process; and PCB, Display and Component Inspection. The company offers inspection and review tools to identify, locate, characterize, review, and analyze defects on various surfaces of patterned and unpatterned wafers; metrology systems that are used to measure pattern dimensions, film thickness, film stress, layer-to-layer alignment, pattern placement, surface topography, and electro-optical properties for wafers; Wafer defect inspection, review, and metrology systems; reticle inspection and metrology systems; chemical process control equipment; wired and wireless sensor wafers and reticles; and semiconductor software solutions that provide run-time process control, defect excursion identification, process corrections, and defect classification to accelerate yield learning rates and reduce production risk. It also provides etch, plasma dicing, deposition, and other wafer processing technologies and solutions for the semiconductor and microelectronics industry. In addition, the company offers direct imaging, inspection, optical shaping, inkjet and additive printing, UV laser drilling and computer-aided manufacturing and engineering solutions for the PCB market; inspection and electrical testing systems to identify and classify defects, as well as systems to repair defects for the display market; and inspection and metrology systems for quality control and yield improvement in advanced and traditional semiconductor packaging markets. The company was formerly known as KLA-Tencor Corporation and changed its name to KLA Corporation in July 2019. KLA Corporation was incorporated in 1975 and is headquartered in Milpitas, California.
Corporate Governance
Recent Events
- Mar 18, 20248-K: Corporate Changes & Voting MattersSee Full Filing
- Mar 01, 2024Dividend Date
- Feb 15, 2024Ex-Dividend Date
- Feb 08, 20248-K: Corporate Changes & Voting MattersSee Full Filing
- Feb 01, 20248-K: Corporate Changes & Voting MattersSee Full Filing