Kulicke and Soffa Industries, Inc.
23A Serangoon North Avenue 5
No. 01-01 K&S Corporate Headquarters
Singapore 554369
Singapore
65 6880 9600
http://www.kns.com
Sector: Technology
Industry: Semiconductor Equipment & Materials
Full Time Employees: 2,389
Key Executives
| Name | Title | Pay | Exercised | Age |
|---|---|---|---|---|
| Mr. Jonathan H. Chou | Chief Financial Officer, Principal Accounting Officer and Exec. VP | 825.38k | N/A | 53 |
| Mr. Lester A. Wong | Sr. VP of Legal Affairs and Gen. Counsel | 564.71k | N/A | 50 |
| Mr. Chan Pin Chong | Sr. VP of AP-Hybrid, Electronics Assembly, Wedge Bonders, Capillaries & Blades Bus. Lines | 927.23k | N/A | 48 |
| Mr. Yih-Neng Lee | Exec. Officer | 561.41k | N/A | 59 |
| Dr. Fusen Ernie Chen Ph.D. | Chief Exec. Officer, Pres and Director | N/A | N/A | 58 |
Description
Kulicke and Soffa Industries, Inc. designs, manufactures, and sells capital equipment and expendable tools to assemble semiconductor devices. It operates in two segments, Equipment and Expendable Tools. The Equipment segment manufactures and sells a line of ball bonders to connect very fine wires made of gold, silver alloy, or copper between the bond pads of the semiconductor devices or dies, and the leads on its package; wafer level bonders, which mechanically applies bumps to dies for some variants of the flip chip assembly process; and wedge bonders to connect semiconductor chips for the power packages, power hybrids, and automotive modules. This segment also provides advanced packaging with adaptive machine analytics chip-to-substrate bonders for flip chip and thermo-compression bonding applications; and electronic assembly solutions, as well as spare parts, equipment repair, maintenance and servicing, equipment upgrading, and training services. The Expendable Tools segment offers various expendable tools for a range of semiconductor packaging applications. This segments products include capillaries for use in ball bonders, as well as gold wire bonding; bonding wedges for use in heavy wire wedge bonders; dicing blades that are used for cutting silicon wafers into individual semiconductor dies. The company serves semiconductor device manufacturers, outsourced semiconductor assembly and test providers, other electronics manufacturers, and automotive electronics suppliers primarily in the United States and the Asia/Pacific region. Kulicke and Soffa Industries, Inc. was founded in 1951 and is headquartered in Singapore.
Corporate Governance
Kulicke and Soffa Industries, Inc.’s ISS Governance QualityScore as of July 1, 2017 is 5. The pillar scores are Audit: 10; Board: 3; Shareholder Rights: 7; Compensation: 2.
