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Kulicke and Soffa Industries, Inc. (KLIC)

NasdaqGS - NasdaqGS Delayed Price. Currency in USD
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22.11-0.42 (-1.86%)
At close: 4:00PM EDT
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Kulicke and Soffa Industries, Inc.

23A Serangoon North Avenue 5
No. 01-01 K&S Corporate Headquarters
Singapore 554369
65 6880 9600

IndustrySemiconductor Equipment & Materials
Full Time Employees2,389

Key Executives

Mr. Jonathan H. ChouChief Financial Officer, Principal Accounting Officer and Exec. VP825.38kN/A53
Mr. Lester A. WongSr. VP of Legal Affairs and Gen. Counsel564.71kN/A50
Mr. Chan Pin ChongSr. VP of AP-Hybrid, Electronics Assembly, Wedge Bonders, Capillaries & Blades Bus. Lines927.23kN/A48
Mr. Yih-Neng LeeExec. Officer561.41kN/A59
Dr. Fusen Ernie Chen Ph.D.Chief Exec. Officer, Pres and DirectorN/AN/A58
Amounts are as of December 31, 2016 and compensation values are for the last fiscal year ending on that date. Pay is salary, bonuses, etc. Exercised is the value of options exercised during the fiscal year. Currency in USD.


Kulicke and Soffa Industries, Inc. designs, manufactures, and sells capital equipment and expendable tools to assemble semiconductor devices. It operates in two segments, Equipment and Expendable Tools. The Equipment segment manufactures and sells a line of ball bonders to connect very fine wires made of gold, silver alloy, or copper between the bond pads of the semiconductor devices or dies, and the leads on its package; wafer level bonders, which mechanically applies bumps to dies for some variants of the flip chip assembly process; and wedge bonders to connect semiconductor chips for the power packages, power hybrids, and automotive modules. This segment also provides advanced packaging with adaptive machine analytics chip-to-substrate bonders for flip chip and thermo-compression bonding applications; and electronic assembly solutions, as well as spare parts, equipment repair, maintenance and servicing, equipment upgrading, and training services. The Expendable Tools segment offers various expendable tools for a range of semiconductor packaging applications. This segment’s products include capillaries for use in ball bonders, as well as gold wire bonding; bonding wedges for use in heavy wire wedge bonders; dicing blades that are used for cutting silicon wafers into individual semiconductor dies. The company serves semiconductor device manufacturers, outsourced semiconductor assembly and test providers, other electronics manufacturers, and automotive electronics suppliers primarily in the United States and the Asia/Pacific region. Kulicke and Soffa Industries, Inc. was founded in 1951 and is headquartered in Singapore.

Corporate Governance

Kulicke and Soffa Industries, Inc.’s ISS Governance QualityScore as of July 1, 2017 is 5. The pillar scores are Audit: 10; Board: 3; Shareholder Rights: 7; Compensation: 2.

Corporate governance scores courtesy of Institutional Shareholder Services (ISS). Scores indicate decile rank relative to index or region. A decile score of 1 indicates lower governance risk, while a 10 indicates higher governance risk.