|Bid||223.40 x 1000|
|Ask||223.76 x 1100|
|Day's Range||221.42 - 225.00|
|52 Week Range||104.90 - 232.74|
|Beta (5Y Monthly)||1.15|
|PE Ratio (TTM)||55.30|
|Earnings Date||Dec 02, 2020 - Dec 07, 2020|
|Forward Dividend & Yield||N/A (N/A)|
|1y Target Est||232.57|
Synopsys, Inc. (Nasdaq: SNPS) today announced that its 3DIC Compiler solution enabled Samsung Foundry to design, implement and tape out a complex 5-nanometer SoC featuring eight high-bandwidth memories (HBMs) in a single package. With 3DIC Compiler, Samsung's multi-die integration (MDI™), based on silicon interposer technology, was able to scale complexity and capacity of new SoC designs for high-performance computing (HPC) applications. The collaboration with 3DIC Compiler accelerated Samsung's design productivity and reduced turnaround time from months to hours.
Synopsys, Inc. (Nasdaq: SNPS) today announced its collaboration with SiMa.ai to bring its machine learning inference at scale to the embedded edge. Through this engagement, SiMa.ai has adopted key products from Synopsys DesignWare® IP, Verification Continuum® Platform, and Fusion Design Platform™ for the development of their MLSoC™, a purpose-built machine-learning platform targeted at specialized computer vision applications, such as autonomous driving, surveillance, and robotics.
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