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STMicroelectronics N.V. (STM)

NYSE - NYSE Delayed Price. Currency in USD
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38.98+0.04 (+0.10%)
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Neutralpattern detected
Previous Close38.94
Open38.89
Bid38.50 x 900
Ask39.50 x 900
Day's Range38.73 - 39.18
52 Week Range21.22 - 43.02
Volume2,330,459
Avg. Volume2,726,648
Market Cap35.221B
Beta (5Y Monthly)1.38
PE Ratio (TTM)32.48
EPS (TTM)1.20
Earnings DateNov 28, 2016 - Nov 29, 2016
Forward Dividend & Yield0.24 (0.62%)
Ex-Dividend DateJun 21, 2021
1y Target Est45.67
  • STMicroelectronics Announces Status of Common Share Repurchase Program
    GlobeNewswire

    STMicroelectronics Announces Status of Common Share Repurchase Program

    PR N°C2995C STMicroelectronics Announces Status of Common Share Repurchase Program Disclosure of Transactions in Own Shares – Period from Apr 6, 2021 to Apr 9, 2021 AMSTERDAM – April 12, 2021 -- STMicroelectronics N.V. (the “Company” or “STMicroelectronics”), a global semiconductor leader serving customers across the spectrum of electronics applications, announces full details of its common share repurchase program (the “Program”) disclosed via a press release dated November 5, 2018. The Program was approved by a shareholder resolution dated May 31, 2018 and by the supervisory board. STMicroelectronics N.V. (registered with the trade register under number 33194537) (LEI: 213800Z8NOHIKRI42W10) (Ticker: “STM”) announces the repurchase (by a broker acting for the Company) on the regulated market of Euronext Paris, in the period between April 6, 2021 to April 9, 2021 (the “Period”), of 317,677 ordinary shares (equal to 0.03% of its issued share capital) at the weighted average purchase price per share of EUR 33.1388 and for an overall price of EUR 10,527,424.97. Below is a summary of the repurchase transactions made in the course of the Period in relation to the ordinary shares of STM (ISIN: NL0000226223), in detailed form. Transactions in Period Dates of transactionNumber of share purchasedWeighted average purchase price per share (EUR)Total amount paid (EUR)Market on which the shares were bought (MIC code)Apr 6, 2021 91,736 33.2189 3,047,369.01 XPARApr 7, 2021 77,623 32.9689 2,559,144.92 XPARApr 8, 2021 79,743 33.2814 2,653,958.68 XPARApr 9, 2021 68,575 33.0580 2,266,952.35 Total for Period 317,677 33.1388 10,527,424.97 Following the share buybacks detailed above, the Company holds in total 10,128,211 treasury shares, which represents approximately 1.1% of the Company’s issued share capital. In accordance with Article 5(1)(b) of Regulation (EU) 596/2014 (the Market Abuse Regulation) and Article 2(3) of Commission Delegated Regulation (EU) 2016/1052, a full breakdown of the individual trades in the Program are disclosed on the ST website (https://investors.st.com/buyback-program). About STMicroelectronicsAt ST, we are 46,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An independent device manufacturer, we work with more than 100,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of the Internet of Things and 5G technology. Further information can be found at www.st.com. For further information, please contact:INVESTOR RELATIONS:Céline BerthierGroup VP, Investor RelationsTel : +41.22.929.58.12celine.berthier@st.com MEDIA RELATIONS:Alexis Breton Corporate External CommunicationsTel: + 33.6.59.16.79.08alexis.breton@st.com Attachment C2995C - ST -- Disclosure of transactions in Own Shares PR -- 12 April 2021 - FINAL FOR PUBLICATION

  • STMicroelectronics Announces Timing for First Quarter 2021 Earnings Release and Conference Call
    GlobeNewswire

    STMicroelectronics Announces Timing for First Quarter 2021 Earnings Release and Conference Call

    PR N° C2993C STMicroelectronics Announces Timing for First Quarter 2021 Earnings Release and Conference Call Geneva – April 6, 2021 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, announced that it will release first quarter 2021 earnings before the opening of trading on the European Stock Exchanges on April 29, 2021. The press release will be available immediately after the release on the Company’s website at www.st.com. STMicroelectronics will conduct a conference call with analysts, investors and reporters to discuss its first quarter 2021 financial results and current business outlook on April 29, 2021 at 9:30 a.m. Central European Time (CET) / 3:30 a.m. U.S. Eastern Time (ET). A live webcast (listen-only mode) of the conference call will be accessible at ST’s website, http://investors.st.com, and will be available for replay until May 14, 2021. About STMicroelectronicsAt ST, we are 46,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An independent device manufacturer, we work with more than 100,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of the Internet of Things and 5G technology. Further information can be found at www.st.com. For further information, please contact:INVESTOR RELATIONS:Céline BerthierGroup VP, Investor RelationsTel : +41.22.929.58.12Celine.berthier@st.com MEDIA RELATIONS:Alexis Breton Corporate External CommunicationsTel: + 33.6.59.16.79.08alexis.breton@st.com Attachment C2993C -- Apr 6 2021 Q1 2021 Earnings Timing - FINAL FOR PUBLICATION

  • STMicroelectronics:
    GlobeNewswire

    STMicroelectronics:

    STMicroelectronics and OQmented to Jointly Develop, Manufacture, and Market Advanced MEMS Mirror-Based Laser-Beam Scanning Solutions Agreement focuses on increasing development and capacity for ultra-compact, low-power laser-beam scanners to expand the market Geneva, Switzerland; and Itzehoe, Germany, March 29, 2021 -- STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, and OQmented, a deep-tech startup focused on MEMS1-mirror technology, have agreed to collaborate on the advancement of the technology for Augmented Reality and 3D-sensing markets. The joint effort aims to build on the expertise of both companies to advance the technology and products behind the leading MEMS-mirror-based laser-beam scanning (LBS) solutions in the market. ST, a world leader in the design, manufacture, and sales of a broad portfolio of MEMS sensors, actuators, and related components including drivers, controllers, and laser-diode drivers, is contributing its vast MEMS design and manufacturing resources to the collaboration. To this foundation, OQmented, is moving to further industrialize and mass produce its Bubble MEMS® technology, a patented 3D glass-encapsulation approach to hermetic vacuum sealing of the MEMS micro-mirrors. Sealing with these unique glass bubbles eliminates environmental contaminants and minimizes light-refraction effects. In fact, vacuum sealing is a key element for meeting automotive-grade requirements, while simultaneously reducing power consumption by an order of magnitude and enhancing performance for resonant, bi-axial scanners, where the MEMS mirrors move in both axes at their resonant frequency, creating an ultra-compact and extremely power-efficient scanning solution. These resonant mirrors are well suited for display and 3D-sensing applications in mobile devices. “In teaming with ST, we’ve chosen a solid semiconductor partner that has demonstrated its leading position in design and manufacturing of MEMS products, particularly MEMS mirrors, over the past 20 years,” said Dr. Ulrich Hofmann, CEO/CTO and co-founder, OQmented. “Combining ST’s expertise in developing, marketing, and manufacturing key components for laser-beam scanning solutions with OQmented’s knowledge and intellectual property will contribute greatly to our product offering, manufacturing capacity, and marketing channels, while also expanding the market in numerous application areas.” “Our goal in working with OQmented is to leverage our shared expertise and deep understanding of LBS technologies with the mutual vision to continue the adoption and growth of LBS in key applications, such as Augmented Reality and 3D sensing,” said Anton Hofmeister, Vice President and General Manager MEMS Microactuator Division, STMicroelectronics. “This collaboration further strengthens ST’s position as a world leader in LBS solutions and expands its market outreach to additional opportunities through the Company’s product portfolio of MEMS mirrors and associated components, including ST’s MEMS drivers, controllers, and Laser Diode Drivers.” From this joint effort, ST and OQmented plan to market a wide range of scanning solutions. These would include MEMS mirrors, MEMS drivers and controllers, and complete reference designs of laser-beam scanning engines for a range of applications. In addition, the companies intend to collaborate on an LBS roadmap and in the development of future technologies and products. About STMicroelectronics At ST, we are 46,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An independent device manufacturer, we work with more than 100,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of the Internet of Things and 5G technology. Further information can be found at www.st.com. About OQmented OQmented is a deep tech company developing and selling high performance MEMS mirrorsfor ultra-compact LBS displays and best in class 3D sensing solutions for mobile and stationaryapplications. The unique Lissajous scan pattern in combination with the patented vacuumpackaging Bubble MEMS® technology and proprietary electronics and software enable newproduct categories in consumer and various other industries. Further information can be found at oqmented.com. For Press Information Contact: Michael MarkowitzDirector Technical Media Relations STMicroelectronics Tel: +1 781 591 0354Email: michael.markowitz@st.com Judith WoehlPublic RelationsOQmentedEmail: media@oqmented.com 1 Micro-Electro-Mechanical Systems (MEMS) leverage Silicon’s unique properties to combine tiny 3-dimensional mechanical structures and electrical circuits on a chip to sense and actuate activity. Attachment T4354D -- Mar 29 2021 -- ST OQmented LBS solutions_FINAL FOR PUBLICATION