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Teledyne Technologies Incorporated (TDY)

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387.15+19.49 (+5.30%)
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Previous Close367.66
Open373.16
Bid351.17 x 1000
Ask410.00 x 900
Day's Range363.32 - 387.92
52 Week Range195.34 - 413.31
Volume354,840
Avg. Volume316,467
Market Cap14.332B
Beta (5Y Monthly)1.07
PE Ratio (TTM)36.45
EPS (TTM)10.62
Earnings DateApr 20, 2021 - Apr 26, 2021
Forward Dividend & YieldN/A (N/A)
Ex-Dividend DateN/A
1y Target Est429.20
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  • Moody's

    Teledyne Technologies Incorporated -- Moody's assigns (P)Baa3 senior unsecured rating to Teledyne Technologies' shelf registration; Outlook stable

    Rating Action: Moody's assigns (P)Baa3 senior unsecured rating to Teledyne Technologies' shelf registration; Outlook stableGlobal Credit Research - 04 Mar 2021New York, March 04, 2021 -- Moody's Investors Service assigned a (P)Baa3 senior unsecured rating to Teledyne Technologies Incorporated's shelf registration. The rating outlook is stable.RATINGS RATIONALEThe (P)Baa3 rating reflects Teledyne's significant scale and leading portfolio of sensors and imaging products across a diverse set of end-markets. Moody's recognizes Teledyne's consistently high R&D spend and the highly engineered nature of its sensor and imaging products, which the rating agency expects to support the company's strong competitive standing across the majority of its niche markets.Teledyne has a track record of steady sales growth and has consistently expanded its profit margins over the last few years.

  • Teledyne Imaging brings its advanced technologies to Vision China 2021
    GlobeNewswire

    Teledyne Imaging brings its advanced technologies to Vision China 2021

    Linea HS TDI camera Teledyne DALSA's Linea HS TDI camera Live demos highlighting new AI and deep learning solutions at the booth SHANGHAI, China, March 04, 2021 (GLOBE NEWSWIRE) -- Teledyne Imaging will exhibit at the upcoming Vision China (Shanghai), in Hall W1, W1-1800, at the Shanghai New International Expo Centre from March 17-19. Visitors to the combined Teledyne Imaging booth can expect to see a broad range of leading-edge line and area scan sensors, frame grabbers, vision systems, software, and smart cameras targeted at vision inspection, logistics, robotics and packaging applications. Here are the highlights: 1. Line Scan Cameras & Embedded Vision The industry’s first Multifield™ CMOS TDI camera, Teledyne DALSA’s award-winning Linea HS captures brightfield, darkfield, and backlit images at once in a single scan. When combined with the Xtium™2 CLHS high-performance frame grabbers, these models achieve unmatched data throughput.Linea Lite is the newest addition to the Linea family, the Linea Lite brings high performance in a small package.Featured “live demo” of the Z-Trak 3D scanners that support up to 16 3D sensors, help remove occlusion and deliver real-time height measurement using laser triangulation and robust In-line measurement.Sherlock8 - next generation vision application software with support for 1D, 2D, 3D and thermal cameras. Includes support for “rules based” and “learning based” AI deep learning vision tools, parallel processing, factory protocols and custom user interfaces.VICORE – New Generation Smart Camera system supports up to 25M. The VICORE system has integrated software, I/O, PLC support and can handle traditional 2D and 3D, as well as infrared inspections.BOA Spot-XL – New Smart sensor is easy to use and contains all vision functionalities from gauging, flaw detection and robotic guidance to product identification (1D/2D/OCR). 2. Smart Sensors Teledyne e2v’s Emerald™ 67M image sensor achieves ultra-high resolution for electronics inspection, high-end surveillance and aerial imaging. Its 8K square resolution combined with its high frame rate enables increased throughput and improved detection ratio.The new high resolution Hydra3D™ Time-of-Flight CMOS image is tailored for 3D detection and distance measurement. It features a 10 µm three-tap cutting-edge pixel and supports the latest industrial applications, including vision guided robotics, logistics and automated guided vehicles. 3. sCMOS cameras Teledyne Photometrics features its latest back-illuminated sCMOS cameras Prime BSI Express and Kinetix. Both achieve 95% quantum efficiency, low read noise and extremely high speed (95 fps for Prime BSI Express and 500fps for Kinetix, full frame).Prime BSI Express camera’s small form factor and USB interface make it fit into the broadest range of configurations. Kinetix camera’s 10-megapixel sensor provides a 29.4 mm field of view, opening up possibilities for new discoveries. 4. Area scan cameras Teledyne’s first CXP camera, designed for performance and built on Genie Nano's proven, industry-leading reputation.Teledyne Lumenera’s new Lt Series Cameras provides high performance USB3 models, from 2 to 20 Mpixels, in both board level and enclosed versions. Subject matter experts will be on hand to discuss planned product development and advanced, enabling technology for your vision challenges. Media Note: For interview requests, please email yuki.chan@teledyne.com or visit our booth in Hall W1, W1-1800 during the show. About Teledyne Imaging Teledyne Imaging is a group of leading-edge companies aligned under the Teledyne umbrella. Teledyne Imaging forms an unrivalled collective of expertise across the spectrum and decades of experience. Individually, each company offers best-in-class solutions. Together, they combine and leverage each other’s strengths to provide the deepest, widest imaging and related technology portfolio in the world. From aerospace through industrial inspection, microscopy, spectroscopy, radiography and radiotherapy, geospatial surveying, and advanced MEMS and semiconductor solutions, Teledyne Imaging offers world-wide customer support and the technical expertise to handle the toughest tasks. Their tools, technologies, and vision solutions are built to deliver to their customers a unique and competitive advantage. Media Contact:Yuki Chan, Marketing Manager, Teledyne e2vYuki.Chan@teledyne.com A photo accompanying this announcement is available at https://www.globenewswire.com/NewsRoom/AttachmentNg/425956dc-0a5b-4a0b-b742-1c3c10ae17c5

  • Teledyne e2v and Yumain announce collaboration to create AI-based imaging solutions for machine vision
    GlobeNewswire

    Teledyne e2v and Yumain announce collaboration to create AI-based imaging solutions for machine vision

    GRENOBLE, France, March 02, 2021 (GLOBE NEWSWIRE) -- Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company and global innovator of imaging solutions, announces a new technology and industrial collaboration with Yumain (Dijon, France), a leading AI vision solution provider serving a broad range of industrial applications. Together, the companies will develop cutting-edge bio-inspired vision solutions that can enable innovation in industrial applications. The recent emergence of AI for industry has rapidly demonstrated its benefits over traditional rule-based methods which have been proven to be unsuitable for applications with high variability e.g. the inspection of complex surfaces with irregularities (brushed aluminum, wood etc.). Yet to be harnessed to its full potential and for AI to be adopted globally, it must be easily setup and trained, optimized by users within minutes (without any AI expertise), provide reliable results, be flexible in application, secure, and low power. By joining forces, Teledyne e2v and Yumain plan to develop significant breakthrough innovations to address these challenges, make AI technology more accessible, and advance it to the next level. Vincent Hector, Vice President of Market Development at Teledyne e2v, says, “We’re very excited to be collaborating with Yumain on this innovative project. Our image sensor capability coupled with their tailored AI expertise will allow us to develop AI-based vision solutions which will be easily accessible for industrial customers and bring real benefits to their applications.” Marc Benoit, Managing Director of Yumain, commented, “Edge AI, as we know it today, consists of an optimization of machine learning models and computation inherited from the cloud. We have 10 years of experience in this field, which has shown us that alternative implementations of AI could be more suitable and scalable for the constraints of factory and production lines. Teledyne e2v’s image sensor design and production expertise are paramount to bringing these novel ideas to reality. This initiative is a key milestone for us and one that emphasizes our potential to investors.” For media enquiries, please contact: Jessica.Broom@teledyne.com | + 44 (0)1245 453607 Teledyne e2v is part of the Teledyne Imaging Group. Their innovations lead developments in healthcare, life sciences, space, transportation, defence and security and industrial markets. Teledyne e2v’s unique approach involves listening to the market and application challenges of customers and partnering with them to provide innovative standard, semi-custom or fully-custom imaging solutions, bringing increased value to their systems. For more information, visit imaging.teledyne-e2v.com Yumain, is a private company based in Dijon, France. Founded in 2011 by an experienced management and academic team, they design and manufacture intelligent vision systems and cameras for Industry 4.0. By leveraging a background in Artificial Intelligence and software and hardware design they serve international clients by focusing on predictive maintenance, quality control, industrial robots and risk prevention. Their approach is based on a unique analysis and real-time decision making process which is made directly from an image. This is acknowledged as a key achievement by their customers and has also received multiple awards from their peers. For more information, visit www.yumain.fr/en/home Teledyne Imaging is a group of leading-edge companies aligned under the Teledyne umbrella. Teledyne Imaging forms an unrivalled collective of expertise across the spectrum with decades of experience. Individually, each company offers best-in-class solutions. Together, they combine and leverage each other’s strengths to provide the deepest, widest imaging and related technology portfolio in the world. From aerospace through industrial inspection, scientific research, spectroscopy, radiography and radiotherapy, geospatial surveying, and advanced MEMS and semiconductor solutions, Teledyne Imaging offers world-wide customer support and the technical expertise to handle the toughest tasks. Their tools, technologies, and vision solutions are built to deliver to their customers a unique and competitive advantage. For more information, visit www.teledyneimaging.com