|Mr. Thomas T. Edman||Pres, CEO & Director||1.28M||N/A||1962|
|Mr. Todd B. Schull||Exec. VP, CFO & Treasurer||726.77k||N/A||1959|
|Mr. Philip Titterton||Exec. VP & COO||584.47k||N/A||1966|
|Mr. Douglas L. Soder||Exec. VP & Pres of Commercial Sector||1.42M||N/A||1961|
|Sameer Desai||Sr. Director of Corp. Devel. & Investor Relations||N/A||N/A||N/A|
|Mr. Daniel J. Weber||Sr. VP, Gen. Counsel & Corp. Sec.||N/A||N/A||1973|
|Mr. O. Clay Swain||Sr. VP of Marketing||N/A||N/A||1964|
|Mr. William Kent Hardwick||Sr. VP of Global Sales & E-MS||N/A||N/A||N/A|
|Mr. Shawn Powers||Sr. VP of HR||N/A||N/A||N/A|
|Mr. Tai Keung Chung||Exec. VP of Asia Pacific Bus. Devel.||N/A||N/A||1956|
TTM Technologies, Inc., together with its subsidiaries, manufactures printed circuit boards (PCBs) worldwide. The company operates through two segments, PCB and E-M Solutions. The company offers a range of PCB products, radio-frequency (RF) components, and electro-mechanical solutions, including conventional PCBs, RF and microwave circuits, high density interconnect PCBs, substrate-like PCBs, flexible PCBs, rigid-flex PCBs, custom assemblies and system integration products, IC substrates, passive RF components, advanced ceramic RF components, multi-chip modules, and beamforming and switching networks. It also produces printed circuits with heavy copper cores, and embedded and press-fit coins; PCBs with electrically passive heat sinks; and PCBs with electrically active thermal cores. In addition, it offers various services, including design for manufacturability, PCB layout design, simulation and testing, and quick turnaround services. The company serves original equipment manufacturers and electronic manufacturing services companies that primarily serve the aerospace and defense, automotive, cellular phone, computing, medical/industrial/instrumentation, and networking/communications end markets of the electronics industry; and the U.S. government. TTM Technologies, Inc. was founded in 1978 and is headquartered in Santa Ana, California.
TTM Technologies, Inc.’s ISS Governance QualityScore as of November 1, 2019 is 4. The pillar scores are Audit: 1; Board: 3; Shareholder Rights: 7; Compensation: 4.