50.35 -0.48 (-0.94%)
After hours: 7:59PM EDT
|Bid||50.35 x 1000|
|Ask||50.46 x 100|
|Day's Range||50.60 - 51.96|
|52 Week Range||33.23 - 53.78|
|PE Ratio (TTM)||25.54|
|Earnings Date||Apr 26, 2018|
|Forward Dividend & Yield||1.20 (2.33%)|
|1y Target Est||53.25|
We pointed last week to the signals that predicted this latest down-leg. It was the big technical reversal signals across the tech heavyweights: Amazon, Apple and Microsoft.
The Trump Administration's plans for tariffs on Chinese tech products could invite retaliation and spell higher costs for U.S. tech firms. But many also haven't been entirely happy with the status quo, ...
Strategic moves like rollout of 4G LTE, introduction and enhancement of LTE handsets have aided U.S. Cellular's (USM) subscriber base. The growing demand for smartphones is another tailwind.
At a recent event organized by Telia in Stockholm, Sweden, Ericsson (ERIC) teamed up with Intel (INTC) and Telia to demonstrate a unique augmented reality (or AR) case over a live 5G (fifth-generation) network. The demo offered a sneak peek into the future, showing how 5G networks can open up a new world of possibilities, such as the delivery of augmented instructions and X-ray vision of objects in real time.
The following is an opinion editorial provided by Navin Shenoy, executive vice president and general manager of the Data Center Group at Intel Corporation.
We’re about nine months into the Intel Xeon Scalable Processor (Skylake), I got the chance to talk with Intel’s Navin Shenoy, EVP. I wanted to share with you what I learned and relay some of the information from Intel’s SOLVE: Healthcare event held today in San Francisco.
Xilinx's Victor Peng is betting on an innovative new chip platform to grow the chipmaker's data center and cloud exposure. And he'd consider making a big acquisition there as well.
Apple (AAPL) may be using wireless chips from Intel (INTC) exclusively in its iPhone models to be released this year, according to a 9to5Mac report citing a research note from analyst Ming-Chi Kuo of KGI Securities. Since iPhone 7, which came out in September 2016, Apple has been obtaining wireless or cellular chips for iPhones from both Intel and Qualcomm (QCOM).
Whereas China (FXI) is the largest consumer of semiconductors in the world, it meets most of its needs through semiconductor imports. The Chinese government plans to invest $160 billion to develop its domestic semiconductor industry, and Tsinghua Unigroup is the biggest beneficiary of this grant. The company spent $24 billion on a NAND plant, which could start manufacturing 32-layer 3D NAND chips by the end of 2018 and ramp up production in 2019. However, China would still be four years behind its South Korean (EWY) competitor, Samsung (SSNLF).
Advanced Micro Devices Inc., Intel Corp.’s main rival in computer microprocessors, said a report earlier this month alleging that its chips have widespread, fundamental vulnerabilities greatly exaggerated ...
Samsung (SSNLF) has set its sights on becoming the world’s top supplier for image sensors, Korean publication Etnews reported. Sony is currently the leading supplier of image sensors, and it controls more than 45% of the global image sensor market, according to Gartner’s estimates.
Intel (INTC) is growing aggressively in the memory market, as memory is a key component in the 5G-connected world. For the first time, Intel has opened its memory business to third-party customers and is now looking for more long-term supply contracts. This fueled several rumors. DRAMeXchange and Nikkei Asian Review, citing industry sources, reported that Intel is in talks with China-based (MCHI) Tsinghua Unigroup subsidiary UNIC Memory Technology over a possible collaboration to develop and produce 3D NAND technologies.
After Intel (INTC) re-entered the memory market in 2015 by converting its China (MCHI) facility into a memory plant, it now competes directly with its memory partner, Micron Technology (MU). In January 2018, Intel officially terminated the partnership, under which the two companies developed 32-layer and 64-layer 3D NAND.