NextFlex Announces 2024 Fellows Awards for Five Outstanding Recipients

Left photo: 2024 Fellows Award recipients are presented with plaques by the NextFlex Co-Executive Directors. (L to R) Erick King, Dr. Art Wall, David Sabanosh, Dr. Kenneth Church, Andrew Kwas, and Dr. Scott Miller. Right photo: (L to R) Madhu Stemmermann receives her plaque from Dr. Art Wall. (Photo: Business Wire)
Left photo: 2024 Fellows Award recipients are presented with plaques by the NextFlex Co-Executive Directors. (L to R) Erick King, Dr. Art Wall, David Sabanosh, Dr. Kenneth Church, Andrew Kwas, and Dr. Scott Miller. Right photo: (L to R) Madhu Stemmermann receives her plaque from Dr. Art Wall. (Photo: Business Wire)

SAN JOSE, Calif., March 28, 2024--(BUSINESS WIRE)--NextFlex®, America's Hybrid Electronics Manufacturing Institute, presented the annual NextFlex Fellow Awards to five deserving individuals in recognition of their exceptional commitment to advanced manufacturing and the additive hybrid electronics member community. A NextFlex Fellow demonstrates leadership and subject matter expertise in support of the NextFlex mission.

This year’s Fellows include:

Kenneth Church, Ph.D., nScrypt
Dr. Church is the founder and CEO of Sciperio, a research and development firm and of nScrypt, a capital equipment company that creates precision 3D manufacturing systems. Dr. Church has Bachelor of Science degrees in Physics and Electrical Engineering and a Master of Science and Ph.D. in Electrical Engineering. He is a pioneer in 3D printed electronics and printed circuit structures. His research interests include lasers and optics and the various ways they interact with a variety of materials, novel antenna designs and optimizations, conformal electronics and tissue engineering. He has more than 80 technical publications and more than a 20 patents or patents pending.

Andrew Kwas, Northrop Grumman
Mr. Kwas has 45 years with NGC/TRW and a total of 47 years working in advanced space programs specializing in, advanced manufacturing, spacecraft design, micro-electronics, nuclear products, space logistics, and astrophysics projects. As a NG Fellow 2, he supports NGC’s key space customers including NASA, AFRL, NRO, DARPA, Army/SMDC, Space RCO, USMC, and the Navy. He is considered one of the prominent advanced manufacturing (AM) experts in the country and has produced over fifty papers in AM, in-space manufacturing, lunar and planetary sciences, hypersonics, and miniaturization of spacecraft components. He brings his innovative approach to problems and has won several corporate awards for innovation.

Erick King, Capital Youth Empowerment Program
Mr. King is the Co-Founder in Executive Director of the Capital Youth Empowerment Program which provides social and economic empowerment programs including fatherhood, workforce development, STEM, and teen sexual health. His unique approach of using evidence-based programming and culturally competent staff was shaped by his work with Fairfax County and Arlington County Court Services Units. In addition, Mr. King recently founded King Consulting and Development Group, Inc. to support diversity and inclusion within university and corporate environments.

David Sabanosh, US Army DEVCOM Armament Center
Mr. Sabanosh serves as the Senior Subject Matter Expert (SME) and Senior Technical Lead for Advanced Manufacturing and Printed Electronics within the Printed Electronics, Energetics, Materials and Sensors (PEEMS) Center at Picatinny Arsenal, New Jersey. Prior to his current position, Mr. Sabanosh was a Quality, Reliability, and Safety Technical Lead for IED Defeat and Robotic Weapons. He was responsible for providing guidance and direction to various Integrated Product Teams (IPTs) to develop new and novel armament and munition systems.

Madhu Stemmermann, SunRay Scientific, Inc.
Ms. Stemmermann has over 25 years of experience in senior leadership roles across sales, manufacturing, supply chain, engineering and product management. Her focus areas include environmental health & safety, customer focus, quality, and lean six sigma. She has worked across various industries such as medical devices, lighting and electronics with Becton Dickinson, Air Products, Honeywell and General Electric

"As with all our previous Fellows, we cannot overstate the positive impact that this year’s recipients have had on the hybrid electronics community and beyond," said NextFlex Co-Executive Director Dr. Art Wall. "The positive impact of each of these awardees has had on the member community is immeasurable and much appreciated. As a consortium, we cannot be effective without standout leaders, and we’re pleased to welcome these illustrious individuals as NextFlex Fellows."

Each of the recipients is a leader in the NextFlex member community; providing technical guidance on future-leaning roadmaps, contributing to successful hybrid electronics development projects, promoting the benefit of STEM education to underserved communities, delivering outstanding workshop content and representing NextFlex to DoD, industry, and academic audiences. These outstanding trailblazers exemplify what’s best about our member community as they help drive the NextFlex mission forward.

About NextFlex

NextFlex is a DoD sponsored Manufacturing Innovation Institute funded by Air Force Research Laboratory Cooperative Agreement numbers FA8650-15-2-5402 and FA8650-20-2-5506. NextFlex is a consortium of companies, academic institutions, non-profits and state, local and federal governments with a shared goal of advancing U.S. manufacturing hybrid electronics. Since its formation in 2015, NextFlex's elite team of thought leaders, educators, problem solvers and manufacturers have come together to collectively facilitate innovation, narrow the manufacturing workforce gap and promote sustainable manufacturing ecosystems. For more information, visit www.nextflex.us and follow NextFlex on LinkedIn.

About Hybrid Electronics

Hybrid Electronics give everyday products the power of silicon ICs by combining them with new and unique low-cost and environmentally friendly additive printing processes and new materials, including structural electronics and additive packaging solutions using novel materials. The result is fast time to market, lightweight, low-cost, and highly efficient smart products that can be flexible, conformable, and stretchable with innumerable uses for consumer, commercial and military applications.

View source version on businesswire.com: https://www.businesswire.com/news/home/20240328483614/en/

Contacts

NextFlex
Karen Savala, 408-797-2219
ksavala@nextflex.us

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