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Tower Semiconductor Ltd. (TSEM)

NasdaqGS - NasdaqGS Real Time Price. Currency in USD
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21.10-0.05 (-0.24%)
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Neutralpattern detected
Previous Close21.15
Open20.99
Bid20.58 x 1200
Ask21.48 x 800
Day's Range20.44 - 21.22
52 Week Range12.13 - 25.80
Volume492,666
Avg. Volume318,340
Market Cap2.253B
Beta (5Y Monthly)1.37
PE Ratio (TTM)28.90
EPS (TTM)0.73
Earnings DateN/A
Forward Dividend & YieldN/A (N/A)
Ex-Dividend DateSep 24, 1997
1y Target Est23.67
  • Tower Semiconductor to Present at SPI Forum Hosted by Semicon Portal Showcasing its Broad Range of Market-Leading Analog Technologies
    GlobeNewswire

    Tower Semiconductor to Present at SPI Forum Hosted by Semicon Portal Showcasing its Broad Range of Market-Leading Analog Technologies

    NEWS ANNOUNCEMENT                                       FOR IMMEDIATE RELEASEAddressing the needs of domestic and worldwide semiconductor companies with innovative analog technological solutions and manufacturing excellence MIGDAL HAEMEK, Israel, October 28, 2020 – Tower Semiconductor (NASDAQ/TASE: TSEM), the leader in high-value analog semiconductor foundry solutions, today announced its participation at the upcoming SPI Forum, hosted by Semicon Portal, presenting the Company’s broad range of market leading analog technologies and process offerings, addressing the unique needs of semiconductor companies in Japan and worldwide.As part of its global spread, the Company operates three manufacturing facilities in Japan. As the sole domestic pure play analog foundry, Tower drives highly successful collaborations with a variety of local semiconductor companies, providing state-of-the-art, innovative solutions bringing to market new and break-through products.During the online conference, Tower will hold a presentation on: Market leading analog foundry solutions for advanced semiconductor market needs. The session will be presented by Kenji Tateiwa, General Manager of R&D Strategic Planning, Process Technology Center at TPSCo, and will be held on Wednesday, November 4, 2020 at 14:55-15:30 Japan local time.For additional information, agenda, and registration, please visit the event page here.About Tower Semiconductor Tower Semiconductor Ltd. (NASDAQ: TSEM, TASE: TSEM), the leader in high-value analog semiconductor foundry solutions, provides technology and manufacturing platforms for integrated circuits (ICs) in growing markets such as consumer, industrial, automotive, mobile, infrastructure, medical and aerospace and defense. Tower Semiconductor’s focuses on creating positive and sustainable impact on the world through long term partnerships and its advanced and innovative analog technology offering, comprised of a broad range of customizable process platforms such as SiGe, BiCMOS, mixed-signal/CMOS, RF CMOS, CMOS image sensor, non-imaging sensors, integrated power management (BCD and 700V), and MEMS. Tower Semiconductor also provides world-class design enablement for a quick and accurate design cycle as well as Transfer Optimization and development Process Services (TOPS) to IDMs and fabless companies. To provide multi-fab sourcing and extended capacity for its customers, Tower Semiconductor operates two manufacturing facilities in Israel (150mm and 200mm), two in the U.S. (200mm) and three facilities in Japan (two 200mm and one 300mm) through TPSCo. For more information, please visit www.towersemi.com.Safe Harbor Regarding Forward-Looking Statements This press release includes forward-looking statements, which are subject to risks and uncertainties. Actual results may vary from those projected or implied by such forward-looking statements. A complete discussion of risks and uncertainties that may affect the accuracy of forward-looking statements included in this press release or which may otherwise affect Tower’s business is included under the heading “Risk Factors” in Tower’s most recent filings on Forms 20-F, F-3, F-4 and 6-K, as were filed with the Securities and Exchange Commission (the “SEC”) and the Israel Securities Authority. Tower does not intend to update, and expressly disclaim any obligation to update, the information contained in this release. Tower Semiconductor Company Contact: Orit Shahar | +972-74-7377440 | oritsha@towersemi.comTower Semiconductor Investor Relations Contact: Noit Levy | +972-4-604-7066 | noitle@towersemi.comAttachment * SPI_2020_Final

  • Tower Semiconductor Announces 2020 Annual Technical Global Symposium Online Event
    GlobeNewswire

    Tower Semiconductor Announces 2020 Annual Technical Global Symposium Online Event

    Tower Semiconductor's Online TGS Event Tower Semiconductor's 2020 Online TGS Event Virtual Symposium brings the Company’s leading team of experts directly to you at the comfort of your own home or office Webinar presentations showcasing Company’s premier Analog technologies, advanced design enablement and manufacturing solutions, including recent developments and future roadmaps for RF, High Performance Analog, Power Management and Sensor platformsMIGDAL HAEMEK, Israel, October 14, 2020 – Tower Semiconductor (NASDAQ/TASE: TSEM), the leader in high-value analog semiconductor foundry solutions, today announced its online 2020 annual Technical Global Symposium. This online event consists of a series of webinars presenting the Company’s premier analog technologies, manufacturing solutions and recent development across all of its platforms including RF & High Performance Analog, Power Management, Sensors, Aerospace & Defense as well as leading design enablement services and tools in joint sessions with selected EDA partners.Similar to the Company’s traditional TGS event format, the webinars will be presented by Tower’s leading team of experts, with the added benefit of direct and easier access to interact online with the presenters and learn more about Company platforms and offerings. The sessions will provide detailed information on Company advanced SOI, SiGe, SiPho, Imaging and Non-Imaging sensors, MEMS and Power Management technologies, development roadmaps and manufacturing excellence. Each webinar will discuss Tower’s best-in-class solutions addressing the current and future market needs of the IoT, 5G, networking, high-end imaging, sensing, automotive, industrial, and consumer markets. Date TopicPresented by November 9, 2020Silicon Photonics and Advanced SiGe Technology for Optical TransceiversDr. Edward Preisler Director of Technology Development, RF & HPA November 10, 2020The latest high voltage and high-power technologies Mr. Erez Sarig Director of Power Management Business Development & Marketing   Japanese session by Mr. Akira Takeishi General Manager of Device Technology & Deputy Director of Power Management / Mixed Signal, TPSCo November 12, 2020Stacking BSI technology, iToF and dTOF for face recognition and next generation global shutter technologyDr. Assaf Lahav CIS Research & Development Expert and Fellow    Japanese session by Mr. Isao Miyanaga General Manager of Device Technology & Deputy Director of Image Sensor, TPSCo November 17, 2020Under OLED and under LCD optical fingerprint sensorsDr. Amos Fenigstein Senior Director of CIS Research & Development, Sensors Business Unit   Japanese session by Mr. Isao Miyanaga General Manager of Device Technology & Deputy Director of Image Sensor, TPSCo November 18, 2020Process technology and PDK enhancements for Wireless Applications Dr. Paul Hurwitz  Director of Device Technology, RF & HPA November 19, 2020MEMS and NIS Technology for UV, radiation, temperature, and gas sensorsMyriam Buchbinder Senior Director of Process Engineering Research & Development   Prof. Yakov Roizin Director of Emerging Technologies & Fellow November 23, 2020Aerospace and Defense Technology SolutionsDr. David Howard Executive Director & Fellow  For additional information, agenda and registration please visit the event page here.  About Tower SemiconductorTower Semiconductor Ltd. (NASDAQ: TSEM, TASE: TSEM), the leader in high-value analog semiconductor foundry solutions, provides technology and manufacturing platforms for integrated circuits (ICs) in growing markets such as consumer, industrial, automotive, mobile, infrastructure, medical and aerospace and defense. Tower Semiconductor’s focuses on creating positive and sustainable impact on the world through long term partnerships and its advanced and innovative analog technology offering, comprised of a broad range of customizable process platforms such as SiGe, BiCMOS, mixed-signal/CMOS, RF CMOS, CMOS image sensor, non-imaging sensors, integrated power management (BCD and 700V), and MEMS. Tower Semiconductor also provides world-class design enablement for a quick and accurate design cycle as well as Transfer Optimization and development Process Services (TOPS) to IDMs and fabless companies. To provide multi-fab sourcing and extended capacity for its customers, Tower Semiconductor operates two manufacturing facilities in Israel (150mm and 200mm), two in the U.S. (200mm) and three facilities in Japan (two 200mm and one 300mm) through TPSCo. For more information, please visit www.towersemi.com.Safe Harbor Regarding Forward-Looking Statements This press release includes forward-looking statements, which are subject to risks and uncertainties. Actual results may vary from those projected or implied by such forward-looking statements. A complete discussion of risks and uncertainties that may affect the accuracy of forward-looking statements included in this press release or which may otherwise affect Tower’s business is included under the heading “Risk Factors” in Tower’s most recent filings on Forms 20-F, F-3, F-4 and 6-K, as were filed with the Securities and Exchange Commission (the “SEC”) and the Israel Securities Authority. Tower does not intend to update, and expressly disclaim any obligation to update, the information contained in this release. Tower Semiconductor Company Contact: Orit Shahar | +972-74-7377440 | oritsha@towersemi.comTower Semiconductor Investor Relations Contact: Noit Levy | +972-4-604-7066 | noitle@towersemi.comAttachments * TGS_2020_Final_101420 * Tower Semiconductor's Online TGS Event

  • GlobeNewswire

    Tower Semiconductor Announces Third Quarter 2020 Financial Results and Conference Call

    MIGDAL HAEMEK, Israel – October 12, 2020 – Tower Semiconductor (NASDAQ/ TASE: TSEM), the leading foundry of high-value analog semiconductor solutions, will issue its third quarter 2020 earnings release on Thursday, November 12, 2020. The Company will hold a conference call on Thursday, November 12, 2020, at 10:00 a.m. Eastern Time (09:00 a.m. Central, 08:00 a.m. Mountain, 07:00 a.m. Pacific and 05:00 p.m. Israel time) to discuss its third quarter 2020 financial results, fourth-quarter 2020 guidance, business outlook as well as will provide additional information on its recent cyber event and actions taken. Further to the expeditious recovery of operations of its manufacturing facilities after the cyber event, the Company expects the third-quarter revenues to be within its previously announced guidance range. This call will be webcasted and can be accessed through the Investor Relations section on Tower Semiconductor’s website at https://ir.towersemi.com/ or can also be accessed by calling the following numbers: U.S. Toll Free: 1-888-642-5032; Israel: 03-918-0644; International: +972-3-918-0644. The teleconference will be available for replay for 90 days. About Tower SemiconductorTower Semiconductor Ltd. (NASDAQ: TSEM, TASE: TSEM), the leading foundry of high value analog semiconductor solutions, provides technology and manufacturing platforms for integrated circuits (ICs) in growing markets such as consumer, industrial, automotive, mobile, infrastructure, medical and aerospace and defense. Tower Semiconductor focuses on creating positive and sustainable impact on the world through long term partnerships and its advanced and innovative analog technology offering, comprised of a broad range of customizable process platforms such as SiGe, BiCMOS, mixed-signal/CMOS, RF CMOS, CMOS image sensor, non-imaging sensors, integrated power management (BCD and 700V), and MEMS. Tower Semiconductor also provides world-class design enablement for a quick and accurate design cycle as well as Transfer Optimization and development Process Services (TOPS) to IDMs and fabless companies. To provide multi-fab sourcing and extended capacity for its customers, Tower Semiconductor operates two manufacturing facilities in Israel (150mm and 200mm), two in the U.S. (200mm) and three facilities in Japan (two 200mm and one 300mm) through TPSCo. For more information, please visit: www.towersemi.comSafe Harbor Regarding Forward-Looking Statements This press release includes forward-looking statements, which are subject to risks and uncertainties. Actual results may vary from those projected or implied by such forward-looking statements. A complete discussion of risks and uncertainties that may affect the accuracy of forward-looking statements included in this press release or which may otherwise affect Tower’s business is included under the heading “Risk Factors” in Tower’s most recent filings on Forms 20-F, F-3, F-4 and 6-K, as were filed with the Securities and Exchange Commission (the “SEC”) and the Israel Securities Authority. Tower does not intend to update, and expressly disclaim any obligation to update, the information contained in this release. Contact Information: Tower Semiconductor Investor Relations | Noit Levy, +972 4 604 7066 | noitle@towersemi.com                           Attachment * TSEM_Q32020_IRCC_FINAL